THERMALLY VANISHING MATERIAL, TRANSFER SHEET USING THE SAME, AND METHOD FOR FORMING PATTERN

Title:

THERMALLY VANISHING MATERIAL, TRANSFER SHEET USING THE SAME, AND METHOD FOR FORMING PATTERN

Document Type and Number:

WIPO Patent Application WO/2004/050762

Kind Code:

A1

Abstract:

A thermally vanishing material, characterized in that it comprises a polyoxyalkylene resin as a primary component, contains oxygen atoms in an amount of 15 to 55 mass %, and 95 wt % or more of the material vanishes on the exposure to a temperature of 150 to 350°C for 10 minutes or less. The thermally vanishing material is less prone to deterioration or decomposition at an ordinary use temperature and vanishes by the heating to a relatively low temperature for a short time, and thus finds widespread application, for example, applications for a method for producing a porous material, a transfer sheet comprising electroconductive fine particles, a transfer sheet for forming a circuit, a method for forming a pattern and the like.

Inventors:

FUKUI HIROJI (JP)
ENAMI TOSHIO (JP)

Application Number:

PCT/JP2003/015104

Publication Date:

June 17, 2004

Filing Date:

November 26, 2003

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)
FUKUI HIROJI (JP)
ENAMI TOSHIO (JP)

International Classes:

B32B7/02; C08G65/329; C08G65/336; C08J11/06; C08K3/22; C08K5/14; C08K5/17; C08K5/23; C08K5/37; C08L71/02; C09J7/02; C09J11/00; C09J171/00; H01B5/14; H01L21/60; H01L21/68; H01L21/768; H05K1/03; H05K3/20; H05K3/34; H05K3/04; (IPC1-7): C08L71/02; C08J9/26; H01L21/60; H01L23/12; H01L23/14; H05K1/03; H05K3/20

Foreign References:

JP2002076203A	2002-03-15
JPH09194548A	1997-07-29
JPH0977966A	1997-03-25
JP2001247849A	2001-09-14
JP2001302936A	2001-10-31
JP2002088267A	2002-03-27
JP2003313443A	2003-11-06
JP2003089742A	2003-03-28
JP2003206584A	2003-07-25
JP2004002549A	2004-01-08
JPH11217458A	1999-08-10
JPH10178255A	1998-06-30
JP2002236357A	2002-08-23

Other References: