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Title:
THERMIC FLUID STATE COMPUTATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/044907
Kind Code:
A1
Abstract:
Provided is technology with which the temperature distribution and the flow velocity distribution of an entire thermic fluid can be ascertained. This thermic fluid state computation apparatus acquires and decomposes multiple sets of a simulation value of the temperature distribution and a simulation value of the flow velocity distribution in a J-dimensional region (J is any value of 1, 2, and 3) representing a portion of the thermic fluid to extract two or more sets of a characteristic temperature distribution and a characteristic flow velocity distribution. The thermic fluid state computation apparatus linearly adds the two or more sets of a characteristic temperature distribution and a characteristic flow velocity distribution to compute a predicted value of the temperature distribution and a predicted value of the flow velocity distribution in the J-dimensional region. The thermic fluid state computation apparatus performs computation such that a predicted temperature distribution value for a predetermined region indicating the temperature distribution in the predetermined region matches a measured temperature distribution value for the predetermined region measured by a measurement unit.

Inventors:
HARADA SHUNTA (JP)
TAKAISHI MASAKI (JP)
KOYAMA YUKINORI (JP)
UJIHARA TORU (JP)
Application Number:
PCT/JP2020/032026
Publication Date:
March 11, 2021
Filing Date:
August 25, 2020
Export Citation:
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Assignee:
NATIONAL UNIV CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (JP)
International Classes:
C30B15/22; C30B29/36; G01K13/02; G01P13/00
Domestic Patent References:
WO2004018742A12004-03-04
Foreign References:
JP2016150882A2016-08-22
JP2018108910A2018-07-12
JP2018169818A2018-11-01
JPH11190662A1999-07-13
JPH03275587A1991-12-06
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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