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Title:
THERMOCONDUCTIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/100172
Kind Code:
A1
Abstract:
　Provided is a thermoconductive resin composition with excellent moldability and which can be rendered thermoconductive by being made to contain a specific thermoconductive inorganic filler, without increasing the quantity of filler contained. The thermoconductive resin composition contains a thermoconductive filler and a binder resin, and the thermoconductive filler is an irregularly-shaped filler having recesses and protrusions on the surface.

Inventors:
KOTANI YUKI
KUSUNOKI TOMOKAZU
YODEN HIROYOSHI
Application Number:
PCT/JP2012/084273
Publication Date:
July 04, 2013
Filing Date:
December 26, 2012
Export Citation:
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Assignee:
PANASONIC CORP (JP)
International Classes:
C09K5/08; C08K3/00; C08L101/00; H01L23/373
Foreign References:
JP2011035221A2011-02-17
JPH06252572A1994-09-09
JP2003026827A2003-01-29
JP2002535469A2002-10-22
JPS58184745A1983-10-28
JP2011046923A2011-03-10
JP2012227271A2012-11-15
JP2002256303A2002-09-11
JP2003197833A2003-07-11
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
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Claims:



 
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