Title:
THERMOCONDUCTIVE SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO2004072181
Kind Code:
A3
Abstract:
A thermoconductive silicone composition comprising : (A) an organopolysiloxane (excluding component (C)), (B) a thermoconductive filler, and (C) at least two organopolysiloxanes as defined by the following general formula that have different values for the subscript n (I), wherein each R<1> is independently selected from monovalent hydrocarbon groups ; R<2 >is an oxygen atom or divalent hydrocarbon group ; R<3> is an alkyl, alkoxyalkyi, alkenyl, or acyl ; n is an integer from 5 to 100 ; and a is an integer from 1 to 3.
Inventors:
FUKUI HIROSHI (JP)
Application Number:
PCT/JP2004/001356
Publication Date:
February 24, 2005
Filing Date:
February 09, 2004
Export Citation:
Assignee:
DOW CORNING TORAY SILICONE (JP)
FUKUI HIROSHI (JP)
FUKUI HIROSHI (JP)
International Classes:
C08K3/00; C08L83/04; C08L83/14; (IPC1-7): C08L83/04; C08K3/00; C08K3/22; C08K9/08; C09K5/08; H01L23/373
Foreign References:
| EP1101798A2 | 2001-05-23 | |||
| EP0839869A2 | 1998-05-06 | |||
| EP0745643A2 | 1996-12-04 |
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