Title:
THERMOELECTRIC CONVERSION MODULE, INSULATED CIRCUIT SUBSTRATE, METHOD FOR JOINING MEMBERS, AND METHOD FOR ATTACHING THERMOELECTRIC CONVERSION MODULE
Document Type and Number:
WIPO Patent Application WO/2021/167089
Kind Code:
A1
Abstract:
This thermoelectric conversion module is formed by arranging and connecting in series, on one surface, a plurality of thermoelectric conversion element pairs in which an n-type thermoelectric conversion element and a p-type thermoelectric conversion element are connected via an electrode plate, said thermoelectric conversion module having a first output terminal and a second output terminal formed on a thermoelectric conversion element pair on one end side and a thermoelectric conversion element pair on the other end side, respectively, from among the plurality of serially connected thermoelectric conversion element pairs, and an intermediate output terminal, which is formed at any position between the thermoelectric conversion element pair on the one end side and the thermoelectric conversion element pair on the other end side.
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Inventors:
ARAI KOYA (JP)
Application Number:
PCT/JP2021/006451
Publication Date:
August 26, 2021
Filing Date:
February 19, 2021
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H02N11/00; H01L35/32; H01L35/34
Domestic Patent References:
| WO2016143620A1 | 2016-09-15 | |||
| WO2019026639A1 | 2019-02-07 |
Foreign References:
| JP2007150231A | 2007-06-14 | |||
| JP2010516061A | 2010-05-13 | |||
| JP2008091442A | 2008-04-17 | |||
| JP2009010138A | 2009-01-15 | |||
| JP2020026446A | 2020-02-20 | |||
| JP2012533972W |
Other References:
See also references of EP 4109734A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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