THERMOELECTRIC CONVERSION MODULE AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2021/241635

A1

Provided are: a thermoelectric conversion module which prevents the misalignment of thermoelectric conversion material chips on an electrode derived from a bonding material and which suppresses short circuits between adjacent thermoelectric conversion material chips and bonding defects between the thermoelectric conversion material chips and the electrode; and method for manufacturing a thermoelectric conversion module. The thermoelectric conversion module comprises: a first substrate that has a first electrode; a second substrate that has a second electrode; a thermoelectric conversion material chip including a thermoelectric semiconductor composition; a first bonding material layer that is made of a first bonding material for bonding the first electrode and one surface of the thermoelectric conversion material chip; and a second bonding material layer that is made of a second bonding material for bonding the second electrode and the other surface of the thermoelectric conversion material chip, wherein the melting point of the second bonding material is lower than the melting point of the first bonding material, or the melting point of the second bonding material is lower than the curing temperature of the first bonding material.

SEKI YUTA (JP)
MORITA WATARU (JP)
KATO KUNIHISA (JP)

PCT/JP2021/019991

December 02, 2021

May 26, 2021

Click for automatic bibliography generation  

LINTEC CORP (JP)

H01L35/08; H01L35/24; H01L35/26; H01L35/34

WO2020071424A1	2020-04-09
WO2017038988A1	2017-03-09

JP2015060899A

2015-03-30

OHTANI PATENT OFFICE (JP)

View/Download PDF      PDF Help

Previous Patent: ULTRASONIC DIAGNOSTIC APPARATUS AND IMAGE PROCESSING APPARATUS

Next Patent: TRANSFER FILM AND METHOD FOR MANUFACTURING LAYERED BODY