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Title:
THERMOELECTRIC CONVERSION MODULE
Document Type and Number:
WIPO Patent Application WO/2021/193358
Kind Code:
A1
Abstract:
Provided is a thermoelectric conversion module with further enhanced thermoelectric performance. This thermoelectric conversion module includes: a base material; and a thermoelectric element layer comprising a thermoelectric semiconductor composition. The thermoelectric semiconductor composition contains a thermoelectric semiconductor material, a heat-resistant resin A, and an ionic liquid and/or an inorganic ionic compound. The thermal resistance of the base material is 0.35 K/W or less.

Inventors:
MORITA WATARU (JP)
KATO KUNIHISA (JP)
SEKI YUTA (JP)
Application Number:
PCT/JP2021/011112
Publication Date:
September 30, 2021
Filing Date:
March 18, 2021
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
H02N11/00; H01L35/16; H01L35/24; H01L35/26; H01L35/32; H01L35/34
Domestic Patent References:
WO2018168837A12018-09-20
WO2005124882A12005-12-29
Foreign References:
JP2001326394A2001-11-22
JP2003174203A2003-06-20
JP2009141079A2009-06-25
JP2012227271A2012-11-15
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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