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Patent Searching and Data


Title:
THERMOELECTRIC CONVERSION MODULE
Document Type and Number:
WIPO Patent Application WO/2023/176581
Kind Code:
A1
Abstract:
Provided is a thermoelectric conversion module that can more efficiently suppress heat (more strictly, radiation heat) that is transmitted from a high temperature side to a low temperature side in a space present between a plurality of thermoelectric conversion elements. A thermoelectric conversion module 1 of the present invention comprises a first electrically insulating substrate 2, a second electrically insulating substrate 3, a plurality of thermoelectric conversion elements 4a, 4b, and connection wires 5, 6, and comprises a radiation heat reflecting member composed of at least one first radiation heat reflecting plate 7. The first radiation heat reflecting plate 7 comprises a first electric insulating plate 11 and a first reflecting layer 12 which is formed on at least one surface of the first electric insulating plate 11 and is disposed so as to be in contact with at least one thermoelectric conversion element of the plurality of thermoelectric conversion elements 4a, 4b. The first radiation heat reflecting plate 7 has a plurality of through-hole portions 10 formed therein that are sized to allow for passage of the plurality of thermoelectric conversion elements 4a, 4b each in a separately defined state. The first reflecting layer 12 comprises an electric insulating portion 13 that electrically insulates the plurality of thermoelectric conversion elements 4a, 4b from each other.

Inventors:
YAMAMOTO KIYOSHI (JP)
YAMAMOTO TAKAHIRO (JP)
SHIMIZU HIROSHI (JP)
MIMURA YU (JP)
Application Number:
PCT/JP2023/008518
Publication Date:
September 21, 2023
Filing Date:
March 07, 2023
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H10N10/13
Domestic Patent References:
WO2017164217A12017-09-28
WO2022196724A12022-09-22
Foreign References:
JP2005079347A2005-03-24
JP2012038980A2012-02-23
US20150034138A12015-02-05
Attorney, Agent or Firm:
KURUMA Kiyoshi et al. (JP)
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