Title:
THERMOELECTRIC CONVERSION SUBSTRATE AND THERMOELECTRIC CONVERSION MODULE
Document Type and Number:
WIPO Patent Application WO/2020/166647
Kind Code:
A1
Abstract:
This thermoelectric conversion substrate (1) comprises an insulating substrate (2) having a first surface (21) and a second surface (22) on respective sides in the thickness direction, a plurality of thermoelectric conversion units (3) each including a first thermoelectric member (31), a second thermoelectric member (32) and a first electrode (41) that electrically connects the first thermoelectric member (31) and the second thermoelectric member (32), and a second electrode (42), wherein: the insulating substrate (2) includes one or more core insulating layers (50); the second electrode (42) electrically connects the first thermoelectric member (31) of one thermoelectric conversion unit (3) and the second thermoelectric member (32) of another thermoelectric conversion unit (3); the plurality of thermoelectric conversion units (3) are electrically connected in series such that the first thermoelectric members (31) and the second thermoelectric members (32) are arranged alternately; and a stress relaxation part (8) is provided between the first thermoelectric member (31) and the second thermoelectric member (32).
Inventors:
MAESHIMA SATOSHI
SEDA TAKASHI
SEDA TAKASHI
Application Number:
PCT/JP2020/005464
Publication Date:
August 20, 2020
Filing Date:
February 13, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L35/32; F25B21/02; H01L35/08
Domestic Patent References:
| WO2017159594A1 | 2017-09-21 |
Foreign References:
| JP2007227508A | 2007-09-06 | |||
| JP2001007411A | 2001-01-12 | |||
| JP2015015407A | 2015-01-22 |
Attorney, Agent or Firm:
NII, Hiromori et al. (JP)
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