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Patent Searching and Data


Title:
THERMOELECTRIC ELEMENT ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2021/235756
Kind Code:
A1
Abstract:
The present invention relates to a thermoelectric element assembly, comprising: a housing (20) having a receiving chamber formed therethrough and a locking protrusion (201) formed at the upper portion thereof; a thermoelectric element (3) of which one side serves as a cooling surface and the other side serves as a heat dissipation surface when power is supplied; a cooling block (40) having a support member (401) protruding from the lower portion and mounted closely on the cooling surface of the thermoelectric element (3) to receive cooling from the cooling surface and transfer same to a cooling target; an elastic member (S) disposed between the locking protrusion (201) and the support member (401) to provide an elastic force for bringing the cooling block (40) into close contact with the thermoelectric element (3); a heat dissipating means (5) in close contact with the heat dissipation surface of the thermoelectric element (3) and dissipating the heat of the heat dissipation surface; a filling material (6) supplied to the receiving chamber of the housing (20) to enclose and seal the received thermoelectric element (3) to block contact of same with air; and a filling material inlet (7) communicating with the receiving chamber of the housing (20) so as to supply the filling material (6) to the receiving chamber of the housing (20).

Inventors:
BANG KWANGCHUL (KR)
Application Number:
PCT/KR2021/005814
Publication Date:
November 25, 2021
Filing Date:
May 10, 2021
Export Citation:
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Assignee:
TMI CO LTD (KR)
International Classes:
F25B21/02; H01L35/32
Foreign References:
JPH0961005A1997-03-07
KR20130092291A2013-08-20
KR20150083312A2015-07-17
KR100991746B12010-11-03
JPH06294560A1994-10-21
KR102210735B12021-02-02
Attorney, Agent or Firm:
LEE, Jaechun (KR)
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