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Patent Searching and Data


Title:
THERMOELECTRIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/2020/153799
Kind Code:
A1
Abstract:
A thermoelectric element of the present invention comprises a first metal substrate, a first resin layer, a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs, a plurality of second electrodes, a second resin layer, and a second metal substrate, wherein the first metal substrate is a low-temperature portion, the second metal substrate is a high-temperature portion, the second resin layer comprises a first layer and a second layer disposed on the first layer, the first and second layers comprise a silicon (Si)-based resin, and the bonding strength of the first resin layer is higher than the bonding strength of the second resin layer.

Inventors:
LEE SEUNG HWAN (KR)
LEE SE WOON (KR)
KANG IN SEOK (KR)
KIM SUNG CHUL (KR)
Application Number:
PCT/KR2020/001194
Publication Date:
July 30, 2020
Filing Date:
January 23, 2020
Export Citation:
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Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L35/04; H01L35/14; H01L35/24; H01L35/32
Foreign References:
KR101195674B12012-10-30
KR20130073554A2013-07-03
JP2010109132A2010-05-13
JPS5525173B21980-07-04
US20160005948A12016-01-07
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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