Title:
THERMOELECTRIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/2022/124674
Kind Code:
A1
Abstract:
According to an embodiment, disclosed is a thermoelectric element comprising: an electrode; a semiconductor structure arranged on the electrode; a diffusion barrier layer arranged on the bottom surface of the semiconductor structure, and having an opening part; a metal layer arranged on the bottom surface of the diffusion barrier layer; and a conductive bonding layer arranged between the metal layer and the electrode, wherein a part of the metal layer extends to the inside of the opening part of the diffusion barrier layer so as to be electrically connected to the semiconductor structure.
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Inventors:
KANG IN SEOK (KR)
Application Number:
PCT/KR2021/017824
Publication Date:
June 16, 2022
Filing Date:
November 30, 2021
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L35/04; H01L35/12; H01L35/32; H01L35/34
Domestic Patent References:
| WO2014199541A1 | 2014-12-18 | |||
| WO2009001598A1 | 2008-12-31 |
Foreign References:
| JP2019062054A | 2019-04-18 | |||
| KR101773869B1 | 2017-09-01 | |||
| KR20130007201A | 2013-01-18 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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