APPARATUS, SYSTEM AND METHOD FOR TRANSFERRING HEAT FIELD OF THE INVENTION This invention relates to heat transfer systems, and more specifically to thermoelectric heat pumps used in such systems.

BACKGROUND OF THE INVENTION Thermoelectric heat pumps, used in some heat transfer systems, typically comprise a thermoelectric element or Peltier junction. A temperature difference between the hot side and the cold side of the pump is created by passing a DC current through semiconductor junctions assembled between, and bonded to, two insulation members, which may be in the form of ceramic plates. Heat is pumped from the cold side to the hot side, and the direction of the current flow determines which side is hot and which side is cold.

In one common construction of known thermoelectric heat pumps, a thermoelectric element is sandwiched between a heat pump and a heat sink, by means of mechanical bolting, thermal gluing or low temperature soldering. In operation, heat is pumped from the heat source through the thermoelectric element and to the heat sink. Accordingly, heat has to pass in turn through the interface between each of the one insulation members and the corresponding metal contact surface of the heat source or heat sink by conduction. The conduction of heat requires a temperature gradient to drive it, and thus leads to a parasitic loss of the temperature gradient in the pump. Thus, part of the heat gradient is used for the conduction of heat through the interfaces rather than discharging heat from the heat source to the heat sink, resulting in a reduction of pump efficiency.

The parasitic loss is manifested as thermal resistance between the insulation members and the metal walls of the heat source and heat sink, and factors which have an effect on this resistance include quality of thermal contact, flatness and surface quality of contacting surfaces, clamping force between contacting surfaces, and"filler"material layer sometimes applied between the contacting surfaces.

In US 5232516, groups of thermocouples are assembled as flat strips and joined to form plates which are enclosed in a vessel. A liquid is caused to flow over the plates from the cold side to the hot side in a single continuous and recirculating closed loop liquid flow path within the vessel. This results in cooling of the liquid by contact with the cold side and warming of the liquid by contact with the hot side of the plates, wherein the cooled liquid is flowed into thermal contact with the cold end portion of the vessel, which is adapted to be in thermal contact with an external heat source from which heat is to be withdrawn. A similar arrangement is disclosed in US 5,228, 923, wherein the thermoelectric device is cylindrical in form with a hollow central annulus member, in which fluid is pumped from the centre of the structure to the outer surface of the annulus member, first over one side and then the other side of a plurality of thermoelectric cells arranged radially in the device. Heat is withdrawn from a small area at the distal end of the cylindrical device.

SUMMARY OF THE INVENTION In accordance with the present invention, there is provided an improved apparatus for transferring heat comprising at least one thermoelectric heat pump element having a first heat transfer face and a second heat transfer face; at least one first heat transfer jacket sealingly mountable with respect to said first heat transfer face of at least one said heat pump element and defining a first fluid flow path in fluid communication with said first heat transfer face, at least one second heat transfer jacket sealingly mountable with respect to said second heat transfer face of at least one said heat pump element and defining a second fluid flow path in fluid communication with said second heat transfer face.

The thermoelectric heat pump elements each transfer heat from one of the faces to the other one of the faces responsive to the flow of an electric current through said element, typically by means of the Peltier effect. Advantageously, the first heat transfer face and said second heat transfer face are comprised on opposed first and second electrically insulating walls, respectively, of each said thermoelectric heat pump element. Thus, it is possible to make use of off-the-shelf thermoelectric heat pump units that are available commercially.

The first fluid flow path and the second fluid flow path each comprise at least one fluid inlet and one fluid outlet in communication with at least one fluid chamber having an opening, said opening configured to be in registry with a corresponding one of said first and second heat transfer surfaces when said first and second heat transfer jackets are sealing mounted to said at least one thermoelectric heat pump element, such as to provide direct fluid communication between a fluid flowing in said chamber and said corresponding first heat transfer face and said second heat transfer face. Optionally, the chambers comprise flow modifying elements, such as for example projections aligned with the flow direction and configured to induce turbulence in fluid flowing in said chambers.

In some embodiments, the first and second heat transfer jackets each comprise a sealing gasket peripherally disposed around said opening for providing a seal between said corresponding one of said first and second heat transfer jackets and said corresponding one of said first and second heat transfer faces when said first and second heat transfer jackets are sealing mounted to said thermoelectric heat pump element. Further, the openings may each be substantially of a similar shape to that of the corresponding said first or second heat transfer face. In one embodiment, the opening is smaller than said corresponding said first or second heat transfer face.

The first and second heat transfer jackets are sealing mounted to said thermoelectric heat pump element in any suitable manner, including welding, clamping, bonding or mechanical securing means. The mechanical securing arrangement may comprise a plurality of screws inserted through co-aligned apertures in said first and second heat transfer jackets and locked via suitable nuts..

In some embodiments, the apparatus comprises a frame member having at least a first sealing surface and a second sealing surface, wherein said frame member sealingly surrounds each said at least one thermoelectric heat pump element such that said first and second heat transfer jackets are sealingly mounted with respect to said first and second heat transfer faces, respectively, of said at least one thermoelectric element via said first and second sealing faces, respectively. The frame member is made from a suitable sealing material. In these embodiments the opening is larger than said corresponding said first or second heat transfer face. Any suitable means can be used for sealingly mounting the first and second heat transfer jackets to the thermoelectric heat pump element via said frame member for example by means of mechanical securing means such as a plurality of screws inserted through co aligned apertures in said first and second heat transfer jackets and said frame member, and locked via suitable nuts.

In other embodiments, the apparatus comprises a plurality of thermoelectric heat pump elements, wherein said first heat transfer faces thereof are substantially aligned along a common plane, and wherein said second transfer faces thereof are substantially aligned along another common plane. The thermoelectric heat pump elements are advantageously arranged in a series. In these embodiments, individual first heat transfer jackets and/or individual second heat transfer jackets may be provided for each said thermoelectric heat pump element. Alternatively, a common first heat transfer jacket may be provided, wherein said common first heat transfer jacket defines a fluid flow path in fluid communication with each said first heat transfer face. In such a case, the chambers of said first heat transfer jacket corresponding to adjacent said thermoelectric heat pump elements are in mutual fluid communication to provide a serial connection. Similarly, a common second heat transfer jacket may be alternatively provided, wherein the common second heat transfer jacket defines a fluid flow path in fluid communication with each said second heat transfer face. The chambers of said second heat transfer jacket corresponding to adjacent said thermoelectric heat pump elements may also be in mutual fluid communication to provide a serial connection.

Optionally, and for any embodiment, one of said first and second heat transfer jackets comprises external cooling fins for dissipating heat.

The present invention is also directed to a heat transfer system comprising, in addition to the heat transfer apparatus of the present invention, the following : - a first fluid circuit operatively connected to said first heat transfer jacket for circulating a fluid through said first fluid flow path of first heat transfer jacket; and a second fluid circuit operatively connected to said second heat transfer jacket for circulating a fluid through said second fluid flow path of second heat transfer jacket One of said first and second fluid circuits comprises a suitable pump and at least one of a radiator and fan, and another one of the first and second fluid circuits comprises a pump and a heat transfer interface in thermal contact with a body from which it is desired to remove heat. Alternatively rather than having the first and second circuits as closed loops, open loop fluid circuits could be provided instead.

The thermoelectric heat pump elements are configured to pump heat from said first heat transfer face to said second heat transfer face. The fluids may each comprises any one of a gas, liquid, solid or mixture thereof, including for example oil, alcohol, in liquid or vapour forms such as steam; air or any gas; and refrigerants such as Freon.

The present invention is also directed to a method for transferring heat comprising : - providing at least one thermoelectric element having a first heat transfer face and a second heat transfer face; providing direct thermal contact between a first heat exchange fluid and said first heat transfer face, said first fluid being in communication with a heat source and; providing direct thermal contact between a second heat exchange fluid and said second heat transfer face, said second fluid being in communication with a heat sink.

The first fluid and the second fluid are caused to flow with respect to said first and second heat transfer faces, respectively.

The first and second fluids may be caused to flow in the first and second fluid circuits either in the same or different directions with respect to the heat pump elements.

Advantages of the arrangement provided by the present invention include the following.

The present invention eliminates the interfacial resistance between the metal surface of the heat exchangers and the ceramic plates of the prior art. Moreover, this results in a significant improvement in the coefficient of performance (COP), which is of particular importance in battery driven applications.

The present invention also enables off-the-shelf thermoelectric heat pumps to be used with little or no modifications, and to be assembled in any required number to provide the required or desired cooling or heating duty. Further, the present invention provides a simple and cost-effective apparatus, which can be assembled or disassembled relatively easily and therefore at low cost.

Further, by effectively separating the heat source fluid circuit from the heat sink fluid fluid circuit, a more robust construction of the heat transfer apparatus can be achieved. Further, it is possible for one array of heat transfer apparatuses to be serviced by a common heat sink fluid circuit, but by individual heat source fluid circuits. In this way, a more efficient system can be provided for dissipating heat from a plurality of heat transfer apparatuses, while at the same time providing flexibility in providing heat exchange to specific heat sources when needed. For example, it may be desired to provide cooling to a number of components of a system, wherein some of the components need cooling some of the time, and others at different times. As such, individual heat source circuits may be provided to each component to switch on and off as required ; at the same time, the common heat sink may be permanently operated to service the system, regardless of which individual heat source circuit is operating at any given moment. Separation of the two circuits also enables one or the other of the circuits to be maintained or repaired without the need to shut off the whole system or to fully dismantle the heat transfer apparatus.

It substantially eliminates the parasitic heat gradient loss, since heat transfer is substantially by convection rather than conduction.

BRIEF DESCRIPTION OF THE DRAWINGS In order to understand the invention and to see how it may be carried out in practice, a preferred embodiment will now be described, by way of non-limiting example only, with reference to the accompanying drawings, in which: Fig. 1 schematically illustrates a transverse cross sectional view of the first embodiment of the heat transfer apparatus of the present invention.

Fig. 2 schematically illustrates a transverse cross sectional view of the second embodiment of the heat transfer apparatus of the present invention.

Fig. 3 schematically illustrates a transverse cross sectional view of the third embodiment of the heat transfer apparatus of the present invention.

Fig. 4 schematically illustrates an exploded isometric view of the fourth embodiment of the heat transfer apparatus of the present invention.

Fig. 5 schematically illustrates a transverse cross sectional view of the fifth embodiment of the heat transfer apparatus of the present invention.

Fig. 6 schematically illustrates the main elements of a first embodiment of the heat transfer system of the present invention.

Fig. 7 schematically illustrates the main elements of a second embodiment of the heat transfer system of the present invention.

DETAILED DESCRIPTION OF THE INVENTION The term"fluid"herein refers to any flowable material or medium and thus includes liquids, gases, some types of solids and any mixtures or combinations thereof.

The present invention relates to an apparatus for transferring heat comprising at least one thermoelectric heat pump element having a first heat transfer face and a second heat transfer face; at least one first heat transfer jacket, each being sealingly mountable with respect to said first heat transfer face of at least one said heat pump element and defining a fluid flow path in fluid communication with said first heat transfer face; at least one second heat transfer jacket, each being sealingly mountable with respect to said second heat transfer face of at least one said heat pump element and defining a fluid flow path in fluid communication with said second heat transfer face.

Referring to Figure 1, a first embodiment of the heat transfer apparatus of the present invention, generally designated with the numeral 100, comprises a thermoelectric heat pump element 150, sandwiched between a first heat transfer jacket 110 and a second heat transfer jacket 130. The heat pump element 150 typically comprises a plurality of thermoelectric couples (not shown) connected to each other in series to form a strip, and a plurality of strips are interconnected to form a heat pump element of any desired shape, for example as described in US 5,232, 516, the contents of which are incorporated herein. Such elements are well known in the art, and may include any thermoelectric heat element that utilizes the Peltier effect for example as marketed by the Melcor Company or the Ferrotec Company. Alternatively, the heat pump element may utilize methods other than the Peltier effect to provide a heating effect on one side thereof and a cooling effect on the other side thereof.

The heat pump element 150 typically is formed with a rectangular plan form (orthogonal to the view illustrated in Fig. 1), though it may be formed in any suitable shape, and is in any case configured such as to provide a first end 151 and a second end 152 opposed thereto. The element 150 further comprises at each one of the said first end 151 and second end 152 a layer 153,154 respectively, of electrical insulating and heat conducting material, typically ceramic such as alumina or silicon nitride, for example, each layer having a heat transfer face 155,156, respectively. Preferably, the layers 153,154 extend beyond the periphery of the first and second ends 151,152, respectively, as illustrated in Fig. 1. When a DC current is passed in a given direction through the element 150 via electrodes 121,122, a thermal gradient is developed and heat flows from the cold plane at the first end 151 via face 155 and layer 153, and to a hot plane at the second end 152, via layer 153 and face 155. By reversing the direction of the DC current, the direction of the heat flow will be reversed as well. The electrodes 121,122, are adapted for connection to any suitable DC power source.

In this embodiment, a frame member 120 is provided surrounding the sides 124 of the element 150, encapsulating the element 150 in a suitable sealing material but with the faces 155,156 exposed. Suitable sealing materials may include, for example, rubber, plastic, polymer, silicone and so on. Thus, the element 150 is sealed from the external environment via frame 120 and layers 153,154, in particular preventing moisture or other liquids from entering the inside of element 150. Advantageously, the electrodes 121,122 are also partially embedded in the frame member 120. The frame member further comprises opposed first and second sealing faces 125,126 which circumscribe the said heat transfer faces 155,156 respectively.

The first and second heat transfer jackets 110,130 are substantially similar one to the other, and each comprises a sealing face, 115,135 respectively, which are complementary to one or the other of said first and second sealing faces 125,126.

In other embodiments, though, the specific geometries of the first and second heat transfer jackets may differ one from the other.

When the first and second heat transfer jackets 110,130 are mounted with respect to the frame member 120, the respective complementary faces 115,125 and 126,135 are pressed into sealing engagement. In this manner, the first and second heat transfer jackets 110,130 are sealingly mounted with respect to said first and second heat transfer faces 155,156.

Typically, the first and second heat transfer jackets 110,130 are made from a flexible material, such as for example plastic, rubber, silicone or a polymer, to facilitate sealing between the faces 115 and 135 and the frame member 120. alternatively, and in other embodiments, the first and second heat transfer jackets 110,130 may each be made from a relatively rigid material, including some metals for example, and further comprise a gasket (not shown) which provides the necessary sealing with the frame member 120.

In this embodiment, the first and second heat transfer jackets 110,130 are mounted directly onto the frame member 120 at either side thereof by means of screws 160 that traverse the three components via aligned openings 170 and are locked by nuts 175. Alternatively, the first and second heat transfer jackets 110, 130 are may be mounted to the frame member 120 in any suitable way, for example including welding, clamping, bonding, and so on. In this manner, no direct pressure or force is applied to the layers 153,154 or to element 150, which are typically fragile components, while maintaining a good seal between the first and second heat transfer jackets 110,130 and the corresponding heat transfer faces 155,156 respectively.

The width L of the frame member 120, from the outer periphery to the inner periphery thereof, is typically, but not restricted to, about 5mm to about 20mm, and the thickness D thereof is typically that of the element 150 or may be larger.

The first and second heat transfer jackets 110,130 each define a different fluid flow path, 116 and 136 respectively, in fluid communication with said first heat transfer face 155 and said second heat transfer face 156, respectively. The fluid flow paths 116,136 each comprise at least one fluid inlet, 111 and 131 respectively, and at least one fluid outlet, 112 and 132 respectively, in communication with at least one fluid chamber, 117 and 137 respectively, each having an opening, 118 and 138 respectively. The openings 118 and 138 are configured to be in registry with said first heat transfer face 155 and second heat transfer face 156, respectively, when the first and second heat transfer jackets, 110,130 respectively, are sealing mounted to said thermoelectric heat pump element 150. This arrangement thus provides direct fluid communication between a fluid flowing in said chambers 117, 137, and said corresponding first heat transfer face 155 and said second heat transfer face 156, respectively, via openings 118,138 respectively. At the same time it is possible to maintain separate the fluid flows to the first heat transfer face 155 and said second heat transfer face 156.

The openings 118,138 are typically of similar shape to the respective first heat transfer face 155 and second heat transfer face 156. Further, and in this embodiment, openings 118,138 are slightly larger than the respective first heat transfer face 155 and second heat transfer face 156, such that the full extent of the said first and second heat transfer faces 155,156 are fully exposed to said chambers 117,137 respectively, so as to maximize heat transfer to and from the fluid flowing in said respective chambers 117,137. The depth of each chamber 117,137 with respect to the corresponding heat transfer face 155,156 is typically, but not restricted to, about lmm to about 10mm.

Optionally, and preferably, the chambers 117,137, comprise flow modifying elements (not shown). Such flow modifying elements may comprise projections or grooves aligned with the flow direction and configured to induce turbulence in fluid flowing in the respective chambers. The projections may also be configured to provide a measure of mechanical protection to the layers 153,154 in the event of mechanical shock or vibration, or overpressure being applied thereto. The projections may thus provide some support to the typically delicate layers 153,154 against possible bending moments applied externally, and also help to damp out undesirable vibrations or mechanical shocks.

Optionally, one of said first and second heat transfer jackets comprises external cooling fins for dissipating heat.

In operation, a suitable DC current is applied to the element 150 via electrodes 121,122, such that heat is transferred from the first heat transfer face 155 to the second heat transfer face 156 via the element 150. A suitable first heat transfer fluid (such as for example: water, oil, alcohol, in liquid or vapour forms such as steam; air or any gas; and refrigerants such as Freon) is caused to flow through the first heat exchange jacket 110 via fluid passage 116, from inlet 111 through chamber 117 and out via exit 112, providing a heat sink via direct thermal contact with the first heat transfer face 155. Similarly, a second heat transfer fluid, which may be of the same type or of a different type to the first heat transfer fluid, is caused to flow through the second heat exchange jacket 130 via fluid passage 136, from inlet 131 through chamber 137 and out via exit 132, providing a heat source via direct thermal contact with the second heat transfer face 156.

Referring to Fig. 2, a second embodiment of the heat transfer apparatus of the present invention, generally designated with the numeral 200, comprises the same elements and features, as described above with respect to the first embodiment, mutatis mutandis, with the differences described herein. Thus, in Fig. 2, features or elements in the second embodiment that are substantially similar to those of the first embodiment are provided with the same reference numeral as for the first embodiment, except that the first digit of the numeral is changed each time from a"1"to a"2".

For example, the first heat transfer jacket 210 comprises a fluid flow path 216 having at least one fluid inlet 211 and at least one fluid outlet 212 in communication with a fluid chamber 217 which has an opening 218. Similarly, the second heat transfer jacket 230 comprises a fluid flow path 236 having at least one fluid inlet 231 and at least one fluid outlet 232 in communication with a fluid chamber 237 which has an opening 238.

In the second embodiment, the frame member 220 is substantially narrower than the first and second heat transfer jackets 210,230 respectively. The first and second heat transfer jackets 210,230 may each comprise a suitable recess 219,239 to partially or fully accommodate the frame member 220, which may be made from a rigid material, for example, and include suitable sealing gaskets 213, 233 made from any suitable sealing material.

In this embodiment, the first and second heat transfer jackets 210,230 are mounted directly onto each other either side thereof by means of screws 260 that traverse the two components via aligned openings 270 and are locked by nuts 275.

Alternatively, the first and second heat transfer jackets 210,230 are may be mounted to each other in any suitable way, for example including welding, clamping, bonding, and so on. In any case, when the heat transfer jackets are mounted on to one another with the element 250 accommodated in the recesses 219,239, the sealing faces 215,235 of the jackets 210,230, respectively, sealingly abut against the frame member 220 itself at the corresponding sealing faces 225, 226, or optionally via the gaskets 213,233. In this manner, and as with the first embodiment, no direct pressure or force is applied to the layers 253,254 or to heat pump element 250, which are typically fragile components, while maintaining a good seal between the first and second heat transfer jackets 210,230 and the corresponding heat transfer faces 255, 256 respectively.

Optionally, a filler material or gasket 290 may also be provided in the interface between Operation of this embodiment is similar to that described for the first embodiment, mutatis mutandis.

Referring to Fig. 3, a third embodiment of the heat transfer apparatus of the present invention, generally designated with the numeral 300, comprises the same elements and features, as described above with respect to the first or second embodiments, mutatis mutandis, with the differences described herein. Thus, in Fig. 3, features or elements in the third embodiment that are substantially similar to those of the first or second embodiment are provided with the same reference numeral as for the first or second embodiment, except that the first digit is changed each time from a"1"or a"2"to a"3".

For example, the first heat transfer jacket 310 comprises a fluid flow path 316 having at least one fluid inlet 311 and at least one fluid outlet 312 in communication with a fluid chamber 317 which has an opening 318. Similarly, the second heat transfer jacket 330 comprises a fluid flow path 336 having at least one fluid inlet 331 and at least one fluid outlet 332 in communication with a fluid chamber 337 which has an opening 338.

In contrast to the first or the second embodiment, the third embodiment does not comprise a frame member. Rather, the first and second heat transfer jackets 310, 330 are sealingly mounted with respect to the first and second heat transfer faces 355,356 via suitable sealing gaskets 313,333 respectively, made from any suitable sealing material. Thus, the first and second heat transfer jackets 310,330 may each comprise a suitable recess 319,339 to partially or fully accommodate the heat pump element 350.

In this embodiment, the first and second heat transfer jackets 310,330 are mounted directly onto each other either side thereof by means of screws 360 that traverse the two components via aligned openings 370 and are locked by nuts 375.

Alternatively, the first and second heat transfer jackets 310,330 are may be mounted to each other in any suitable way, for example including welding, clamping, bonding, and so on. In any case, when the heat transfer jackets are mounted on to one another with the element 350 accommodated in the recesses 319,339, the sealing faces 315,335 of the jackets 310,330, respectively, sealingly abut against the element 350 itself via the gaskets 313,333. Preferably, an additional gasket 390 is provided between the first and second heat transfer jackets 310,330. The depth dimensions of the recesses 319, 339 and of the gaskets 313, 333 and 390 need to be controlled so that no undue pressure or force is applied to the heat conducting and electrical insulating layers 353,354 or to heat pump element 350, which are typically fragile components, but rather just enough to maintaining a good seal between the first and second heat transfer jackets 310,330 and the corresponding heat transfer faces 355,356 respectively.

Further in contrast to the first and second embodiments, the openings 318, 338 of chambers 317,337 are slightly smaller than the respective first heat transfer face 355 and second heat transfer face 356, to enable sealing to occur between the said first and second heat transfer faces 355,356 and the jackets 310,330 respectively.

Operation of this embodiment is similar to that described for the first embodiment, mutatis mutandis.

Referring to Fig. 4, a fourth and preferred embodiment of the heat transfer apparatus of the present invention, is generally designated with the numeral 400, and comprises the same elements and features, as described above with respect to the first embodiment, mutatis mutandis, with the differences described herein. In particular, a plurality of heat pump elements 450 are comprised in the heat transfer apparatus 400 rather than a single element. Typically, the plurality of elements 450, which may be 4 elements, or which may less or more than 4 elements, depending on the application, and arranged in series, as illustrated in Fig. 4, or alternatively in a panel, in a plurality of rows and columns.

In this embodiment, a common frame member 420 is provided similar to the frame member of the first embodiment, but encapsulates each one of the elements 450 such as to expose the corresponding heat exchange faces 455,456 of each element, as well as to enable electrical connection to the electrodes 421,422 thereof.

Similarly, a common second heat transfer jacket 430 is provided, similar to the second heat transfer jacket of the first embodiment, but serves to provide heat transfer fluid with respect to all the elements 450, in particular the second heat exchange faces 456 thereof. Thus, the second heat transfer jacket 430 comprises a fluid flow path 436 having at least one fluid inlet 431 and at least one fluid outlet 432 in communication with a plurality of fluid chamber 437, each of which has an opening 438. Each fluid chamber 437, and particularly the corresponding openings 438, is adapted to be in registry with a corresponding said second heat exchange face 456 of an element 450. The second heat transfer jacket 430 may be configured to provide heat transfer fluid in parallel to the chambers 437, wherein each chamber 437 is fed from a common manifold in communication with the fluid source.

Alternatively, and preferably, the second heat transfer jacket 430 is configured to provide heat transfer fluid in series to the chambers 437, and the flow path 436 is such as to include fluid communication between adjacent fluid chambers 437 via interconnecting channels 439.

A first heat transfer jacket 410 is also provided, similar to the common second heat transfer jacket 430, providing heat transfer fluid with respect to the first heat exchange faces 455 of all the elements 450. Thus, the first heat transfer jacket 410 also comprises a fluid flow path having at least one fluid inlet 411 and at least one fluid outlet 412 in communication with a plurality of fluid chambers, each of which has an opening, adapted to be in registry with a corresponding said first heat exchange face 455 of an element 450. As with the second heat transfer jacket 430, the first heat transfer jacket 410 may be configured to provide heat transfer fluid in parallel to the chambers 437, wherein each chamber 437 is fed from a common manifold in communication with the fluid source. Alternatively, and preferably, the first heat transfer jacket 410 is also configured to provide heat transfer fluid in series to the chambers 437, and the flow path is such as to include fluid communication between adjacent fluid chambers via suitable interconnecting channels.

As with the first embodiment, the first and second heat transfer jackets 410, 430 are mounted directly onto the frame member 420 on other either side thereof by means of screws or in any suitable manner, for example including welding, clamping, bonding, and so on. In any case, when the heat transfer jackets are mounted on to the frame member 420, the corresponding sealing faces of the jackets 410,430, sealingly abut against the frame member 420 itself at the sealing faces thereof, or optionally via suitable gaskets. In this manner, and as with the first embodiment, no direct pressure or force is applied to the ceramic layers or to heat pump element 450 themselves, which are typically fragile components, while maintaining a good seal between the first and second heat transfer jackets 410,430 and the corresponding heat transfer faces 455,456 respectively.

The fourth embodiment has been described as being substantially based on the constructional features of the first embodiment, but extended to incorporate a plurality of heat pump elements. Similarly, a heat transfer apparatus according to the present invention may also be provided having a plurality of heat pump elements and based on the constructional features of the second or third embodiments, mutatis mutandis. It is also possible to provide such an apparatus having a plurality of heat pump elements, wherein any particular heat pump element may have the constructional features of the first, second or third embodiments, mutatis mutandis.

In operation, a suitable DC current is applied to the each of the heat pump elements 450 via their corresponding electrodes 421,422, such that heat is transferred from the first heat transfer face 455 to the second heat transfer face 456 thereof. A suitable first heat transfer fluid is caused to flow through the first heat exchange jacket 410 via the fluid passage thereof, from inlet 411 through each chamber therein and out via exit 412, providing a heat sink via direct thermal contact with the first heat transfer faces 455. Similarly, a second heat transfer fluid, which may be of the same type or of a different type to the first heat transfer fluid, is caused to flow through the second heat exchange jacket 430 via fluid passage 436, from inlet 431 through chambers 437 and interconnecting ducts 439, and out via exit 432, providing a heat source via direct thermal contact with the second heat transfer face 456.

Referring to Fig. 5, a fifth embodiment of the heat transfer apparatus of the present invention is generally designated with the numeral 500, and comprises the same elements and features, as described above with respect to the fourth embodiments, mutatis mutandis, with the differences described herein. As with the fourth embodiment, a plurality of heat pump elements are comprised in the heat transfer apparatus 500. Typically, the plurality of heat pump elements such as 550A, 550B, 550C1 and 550C2 (generally identified with numeral 550n), may comprise 4 heat pump elements, as illustrated in the figure, or may be less or more than 4 elements, depending on the application. The heat pump elements 550n may be advantageously arranged in series, as illustrated in Fig. 5, or alternatively in a panel, in a plurality of rows and columns in any desired spatial arrangement, typically coplanarly arranged.

In this embodiment, a common frame member 520 is provided similar to the frame member of the fourth embodiment, but encapsulates each one of the heat pump elements 550n such as to expose the corresponding heat exchange faces 555, 556 of each element, as well as to enable electrical connection to the electrodes (not shown) thereof.

Similarly, a common second heat transfer jacket 530 is provided, similar to the second heat transfer jacket of the fourth embodiment, that serves to provide heat transfer fluid with respect to all the elements 550n, in particular the second heat exchange faces 556 thereof. Thus, the second heat transfer jacket 530 comprises a fluid flow path 536 having at least one fluid inlet 531 and at least one fluid outlet 532 in communication with a plurality of fluid chambers 537, each of which has an opening. Each fluid chamber 537, and particularly the corresponding openings, is adapted to be in registry with a corresponding said second heat exchange face 556 of an element 550n. Preferably, the flow path 536 is such as to include fluid communication between adjacent fluid chambers 537 via interconnecting channels 539.

In contrast to the fourth embodiment, a plurality of first heat transfer jackets 510A. 510B, 510C (generally identified with numeral 510n) are also provided, each providing heat transfer fluid with respect to the first heat exchange faces 555 of selected elements 550n. For example, first heat exchange jackets 510A, 510B provide heat exchange with respect to elements 550A, 550B, respectively, while the first heat exchange jacket 510C provides heat exchange with respect to both elements 550C1 and 550C2. Thus, each of the first heat transfer jacket 510n also comprises a fluid flow path having at least one fluid inlet 511n and at least one fluid outlet 512n in communication with one or a plurality of fluid chambers, according to whether the jacket is providing heat exchange to one or a plurality of elements 550n, and each jacket has an opening, adapted to be in registry with a corresponding said first heat exchange face 555 of an element 550n. Where the first heat exchange jacket 510n provides heat exchange to more than one element 550n, the corresponding fluid flow path is such as to include fluid communication between adjacent fluid chambers via suitable interconnecting channels 519.

As with the fourth embodiment, the plurality of first heat transfer jackets 510n as well as the second heat transfer jackets, 530 are mounted directly onto the frame member 520 on other either side thereof by means of screws or in any suitable manner, for example including welding, clamping, bonding, and so on. In any case, when the heat transfer jackets are mounted on to the frame member 520, the corresponding sealing faces of the jackets 510n, 530, sealingly abut against the frame member 520 itself at the sealing faces thereof, or optionally via suitable gaskets. In this manner, and as with the fourth embodiment, no direct pressure or force is applied to the ceramic layers or to heat pump element 550n themselves, which are typically fragile components, while maintaining a good seal between the first and second heat transfer jackets 510n, 530 and the corresponding heat transfer faces of the elements 550n.

As with the fourth embodiment, the fifth element has been described as being substantially based on the constructional features of the first embodiment, but extended to incorporate a plurality of heat pump elements. Similarly, a heat transfer apparatus according to the fifth embodiment of the present invention may also be provided having a plurality of heat pump elements and based on the constructional features of the second or third embodiments, mutatis mutandis. It is also possible to provide such an apparatus having a plurality of heat pump elements, wherein any particular heat pump element may have the constructional features of the first, second or third embodiments, mutatis mutandis. According to the present invention, it is also possible to provide a plurality of second heat pump elements as well as a plurality of first heat pump elements.

Thus, the fifth embodiment provides a modular arrangement, wherein one or a plurality of first heat transfer jackets and second heat transfer jackets may be sealingly mounted to any combinations of heat pump elements that are fixed onto a frame member.

In operation, a suitable DC current is applied to the each of the heat pump elements 550n via their corresponding electrodes such that heat is transferred from the first heat transfer face to the second heat transfer face thereof, or in the opposite direction, depending on whether the common second heat transfer jacket is required as a common heat source or a common heat sink. A suitable first heat transfer fluid is caused to flow through the each of the first heat exchange jacket 510n via the fluid passage thereof, from inlets 511n through each corresponding chamber therein and out via exit 512n, providing, say, a heat sink via direct thermal contact with the first heat transfer faces of the elements 550n. The same first heat transfer fluid may be used for all said first heat transfer jackets, or alternatively different first heat transfer fluids may be used. Similarly, a second heat transfer fluid, which may be of the same type or of a different type to the first heat transfer fluid, is caused to flow through the second heat exchange jacket 530 via fluid passage 536, from inlet 531 through chambers 537 and interconnecting ducts 539, and out via exit 532, providing a heat source via direct thermal contact with the second heat transfer face of the elements 550n.

Referring to Figure 6, a first embodiment of a heat transfer system according to the present invention is illustrated, designated with the numeral 800, and comprising a heat transfer apparatus 600 according to any one of the first through fourth embodiments of the present invention. The heat transfer apparatus 600 comprises one or a plurality of heat pump elements having a first heat transfer jacket 610 and a second heat transfer jacket 630 sealingly mounted onto opposed faces of each of the element, each of which is operatively connected to a suitable DC power source 870. The power source may include any one of or combination of batteries, solar cells, AC power plus AC/DC converter, and so on. The system 800 comprises a first fluid circuit 810 operatively connected to said first heat transfer jacket 610 via the inlet 611 and outlet 612 thereof, for circulating a fluid through said fluid flow path of first heat transfer jacket 610. The first circuit 810 is in thermal contact with a thermal load 850 or a heat transfer interface in thermal contact with a body from which it is desired to remove heat.

Optionally, the first circuit 810 comprises a pump (not shown) for pumping a heat exchange fluid therethrough. Alternatively, the heat transfer apparatus may be oriented in an appropriate manner so that fluid circulation is effected by gravity.

The system 800 further comprises a second fluid circuit 830 operatively connected to said second heat transfer jacket 630 via the inlet 631 and outlet 632 thereof, for circulating a fluid through said fluid flow path of second heat transfer jacket 630. The second fluid circuit 830 preferably comprises a suitable pump 835 and at least one of a radiator 836 and fan 837. Alternatively, the heat transfer apparatus may be oriented in an appropriate manner so that fluid circulation is effect by gravity.

In operation, a suitable DC current is supplied to the heat transfer apparatus 600, which in this example is adapted to pump heat from a first heat transfer face to a second heat transfer face thereof. The second heat transfer face of the apparatus 600 is in thermal contact with a second fluid, which is pumped via pump 835 or gravity through the second circuit 830. Heat is extracted by the fluid from the second heat transfer face via second heat transfer jacket 630, and this heat is dissipated via fan 836 and/or radiator 837. At the same time, a first fluid, which is in thermal contact with the first heat transfer face, is pumped via a pump or gravity through the heat circuit 810. Heat is extracted by the fluid from the thermal load 850 and passed to the first heat transfer face via first heat transfer jacket 610, leading to the desired cooling effect at the thermal load 850.

A second embodiment of the system is illustrated in Figure 7 and comprises all the heat pump elements and features as described for the first embodiment of the system, with the following differences, mutatis mutandis. In the second embodiment, the heat transfer system 900 comprises a heat transfer apparatus 700 according to fifth embodiments of the present invention. The heat transfer apparatus 700 comprises a plurality of heat pump elements having a plurality of first heat transfer jacket 710n and a second heat transfer jacket 730 sealingly mounted onto opposed faces of each of the heat pump elements, each of which is operatively connected to a suitable DC power source (not shown). The system 900 comprises a plurality of first fluid circuits 910n, each operatively connected to one or more of said first heat transfer jackets 710n via the corresponding inlet 711n and outlet 712n thereof, for circulating a fluid through said fluid flow paths of each first heat transfer jacket 710n. Each first circuit 910 is in thermal contact with a thermal load 950n or a heat transfer interface in thermal contact with a body from which it is desired to remove heat.

Optionally, each first circuit 910n comprises a pump (not shown) for pumping a heat exchange fluid therethrough. Alternatively, the individual heat transfer apparatuses may be oriented in an appropriate manner so that fluid circulation is effected by gravity.

The system 900 further comprises a second fluid circuit 930 operatively connected to said second heat transfer jacket 730 via the inlet 731 and outlet 732 thereof, for circulating a fluid through said fluid flow path of second heat transfer jacket 730. The second fluid circuit 930 preferably comprises a suitable pump 935 and at least one of a radiator 936 and fan 937. Alternatively, the heat transfer apparatuses may be oriented in an appropriate manner so that fluid circulation is effect by gravity.

In operation, a suitable DC current is supplied to each heat transfer apparatus 700, which in this example is adapted to pump heat from a first heat transfer face to a second heat transfer face thereof. The second heat transfer face of the apparatus 700 is in thermal contact with a second fluid, which is pumped via pump 935 or gravity through the second circuit 930. Heat is extracted by the fluid from the second heat transfer face via second heat transfer jacket 730, and this heat is dissipated via fan 936 and/or radiator 937. At the same time, a first fluid, which is in thermal contact with the first heat transfer face of the heat pump elements is pumped via a pump or gravity through each of the heat transfer circuits 910n. Heat is individually extracted by the corresponding first fluid from each the thermal load 950n and passed to the corresponding first heat transfer face (s) via first heat transfer jacket 710n, leading to the desired cooling effect at the thermal loads 950n.

Alternatively, a plurality of second fluid circuits may be provided, each of which services one or more heat pump elements, rather than a common second heat transfer jacket.

Alternatively, a common first fluid transfer jacket may be provided to extract heat from one or more interconnected thermal loads, while providing a plurality of second fluid circuits, each of which services one or more heat pump elements.

In the second embodiment it is therefore possible to operate a plurality of first fluid circuits 910n, each of which is operatively connected to a specific thermal load 950n, while dissipating the heat removed via a common second fluid circuit 930. This has the advantage of enabling the operator of the system to individually operate a plurality of heat sources 950n independently one from the other, one being switched on while another is being replaced or maintained, while at the same time operating an efficient common heat sink circuit. This provides great operating flexibility.

In the first and second embodiments of the system, the first fluid and the second fluid may each comprise any one of a gas, liquid, solid or mixture thereof, including, for example, water.

While only some selected embodiments have been described in detail herein, it is readily understood that many modifications and variations of the present invention are possible within the spirit, concept and scope of the invention as set out in the appended claims.