THERMOELECTRIC MATERIAL AND FORMING METHOD THEREFOR

Title:

THERMOELECTRIC MATERIAL AND FORMING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2023/243962

Kind Code:

A1

Abstract:

A thermoelectric material and a forming method therefor are provided. The thermoelectric material has chemical formula 1. [Chemical formula 1] [(Bi2)m(Bi2Ch3)n](1-y)/l[A2Qx]y (In chemical formula 1, Ch=Te or Se, A=Li, Na, K, Rb, or Cs, Q=S, Se, or Te, x=1 through 6, and 0≤y≤0.4) The forming method for the thermoelectric material comprises the steps of: sealing a reactant comprising Bi, Te, Se, and A2Qx (A=Li, Na, K, Rb, or Cs, Q=S, Se, or Te, and x=1 through 6), and then heating and melting same to react; forming an ingot by cooling the product of the reaction; and grinding the ingot into powder and sintering same.

Inventors:

CHUNG IN (KR)
LEE HYUNGSEOK (KR)

Application Number:

PCT/KR2023/008029

Publication Date:

December 21, 2023

Filing Date:

June 12, 2023

Export Citation:

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Assignee:

SEOUL NAT UNIV R&DB FOUNDATION (KR)

International Classes:

H10N10/853; H10N10/01; H10N10/10; H10N10/852

Foreign References:

KR20220039123A	2022-03-29
KR20180100868A	2018-09-12
KR20120019701A	2012-03-07
KR20140065721A	2014-05-30
KR20190072300A	2019-06-25

Attorney, Agent or Firm:

KANG, Moonho (KR)

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