Title:
THERMOELECTRIC MODULE
Document Type and Number:
WIPO Patent Application WO/2019/082928
Kind Code:
A1
Abstract:
This thermoelectric module is provided with: a pair of support substrates 11, 12 having regions that face each other; wiring conductors 21, 22, each of which is located on one mutually facing principal surface of the pair of support substrates 11, 12; a plurality of thermoelectric elements 3 located between the one principal surfaces of the pair of support substrates 11, 12; a lead member 4 joined to the wiring conductor 21 located on one support substrate 11 from among the pair of support substrates 11, 12; and an electroconductive bonding material 5 for joining the wiring conductor 21 and the lead member 4 together. The lead member 4 includes a core wire 41 and a cover layer 42 for covering the core wire 41 further toward the rear-end side than the front end part where the core wire 41 is exposed, the width of a joint interface between the electroconductive bonding material 5 and the wiring conductor 21 being narrower on the side near to the thermoelectric element 3 than on the side far from the thermoelectric element 3 as seen at a cross-section perpendicular to the axial direction of the lead member 4.
Inventors:
FURUKAWA TOMOHIRO (JP)
Application Number:
PCT/JP2018/039497
Publication Date:
May 02, 2019
Filing Date:
October 24, 2018
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L35/10; H02N11/00
Foreign References:
| JP2016171230A | 2016-09-23 | |||
| JP2008244239A | 2008-10-09 | |||
| JP2003197982A | 2003-07-11 | |||
| JP2008244239A | 2008-10-09 |
Other References:
See also references of EP 3703139A4
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