Title:
THERMOELECTRIC MODULE
Document Type and Number:
WIPO Patent Application WO/2020/096228
Kind Code:
A1
Abstract:
A thermoelectric module according to one embodiment of the present invention comprises: a first substrate; a thermoelectric element disposed on the first substrate; a second substrate disposed on the thermoelectric element and having a smaller area than the first substrate; a sealing part disposed on the first substrate and surrounding a side surface of the thermoelectric element; and a wire part connected to the thermoelectric element, drawn out through the sealing part, and supplying power to the thermoelectric element, wherein the sealing part has a through hole through which the wire part passes, and the through hole is disposed closer to the second substrate than to the first substrate.
Inventors:
PARK JIN GYEONG (KR)
PARK JEUNG OOK (KR)
CHO YONG SANG (KR)
PARK JEUNG OOK (KR)
CHO YONG SANG (KR)
Application Number:
PCT/KR2019/013923
Publication Date:
May 14, 2020
Filing Date:
October 23, 2019
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L35/32; H01L35/04; H01L35/16; H01L35/18
Foreign References:
| US20170279026A1 | 2017-09-28 | |||
| JP2013191801A | 2013-09-26 | |||
| JPH05183195A | 1993-07-23 | |||
| JP2007035974A | 2007-02-08 | |||
| JP2000349353A | 2000-12-15 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
Download PDF: