Title:
THERMOELECTRIC MODULE
Document Type and Number:
WIPO Patent Application WO/2023/149743
Kind Code:
A1
Abstract:
A thermoelectric module according to one embodiment of the present invention comprises: a first substrate; a first electrode disposed on the first substrate; a semiconductor structure disposed on the first electrode; a second electrode disposed on the semiconductor structure; a second substrate disposed on the second electrode; and a heat sink disposed on the second substrate, wherein the heat sink includes, on the surface thereof, a plurality of grooves extending in a first direction through which fluid passes, the plurality of grooves have the same first width in the direction parallel to the surface of the heat sink and perpendicular to the first direction and have the same depth in the direction perpendicular to the surface of the heat sink, and the first width is 1 to 10㎛ and the depth is 1 to 10㎛.
Inventors:
KIM JONG HYUN (KR)
Application Number:
PCT/KR2023/001571
Publication Date:
August 10, 2023
Filing Date:
February 03, 2023
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H10N19/00; H10N10/80
Foreign References:
| KR102170479B1 | 2020-10-28 | |||
| JP2006080326A | 2006-03-23 | |||
| CN212901419U | 2021-04-06 | |||
| US8371367B2 | 2013-02-12 | |||
| KR100984112B1 | 2010-09-28 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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