Title:
THERMOELECTRIC TRANSDUCER, THERMOELECTRIC MODULE, BINDER AND METHOD FOR MANUFACTURING THERMOELECTRIC TRANSDUCER
Document Type and Number:
WIPO Patent Application WO/2021/205803
Kind Code:
A1
Abstract:
A thermoelectric transducer 10a includes a P-type thermoelectric layer 11, a first metal layer 14a, a second metal layer 14b, a first binder layer 13a and a second binder layer 13b. The P-type thermoelectric layer 11 comprises a thermoelectric material containing Mg and at least one of Sb and Bi. The first metal layer 14a and the second metal layer 14b contain Cu or a Cu alloy. The first binder layer 13a and the second binder layer 13b contain Al or an Al alloy containing Mg.
Inventors:
KAWABE TAKESHI
KANEKO YURIKO
KANNO TSUTOMU
TAMAKI HIROMASA
KANEKO YURIKO
KANNO TSUTOMU
TAMAKI HIROMASA
Application Number:
PCT/JP2021/009381
Publication Date:
October 14, 2021
Filing Date:
March 09, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L35/08; H01L35/18; H01L35/32; H01L35/34; H02N11/00
Domestic Patent References:
| WO2017072982A1 | 2017-05-04 | |||
| WO2020003554A1 | 2020-01-02 | |||
| WO2020003554A1 | 2020-01-02 |
Foreign References:
| JPH09293906A | 1997-11-11 | |||
| KR20030092692A | 2003-12-06 | |||
| JP6127281B1 | 2017-05-17 |
Other References:
D. KRAEMER: "High thermoelectric conversion efficiency of MgAgSb-based material with hot-pressed contacts", ENERGY ENVIRON. SCI., vol. 8, 2015, pages 1299 - 1308
See also references of EP 4135057A4
See also references of EP 4135057A4
Attorney, Agent or Firm:
KAMADA Koichi et al. (JP)
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