Title:
THERMOPILE SENSOR
Document Type and Number:
WIPO Patent Application WO/2021/176793
Kind Code:
A1
Abstract:
This thermopile sensor is provided with a thermopile in which thermocouples composed of polysilicon wirings and metal films are connected in series on an insulation film. The thermocouples are connected such that the metal films overlap on the polysilicon wirings. The thermocouples are positioned side-by-side with a prescribed gap therebetween, and in a connection portion connecting the thermocouples, the metal film crosses the gap between the polysilicon wirings. The interval between polysilicon wirings in the portion where the metal film crosses is wider than the interval between polysilicon wirings in other portions.
Inventors:
KASAI TAKASHI (JP)
MOMOTANI KOJI (JP)
MOMOTANI KOJI (JP)
Application Number:
PCT/JP2020/046684
Publication Date:
September 10, 2021
Filing Date:
December 15, 2020
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
G01P5/10; G01F1/688; G01J5/12; G01K7/02; H01L35/04
Foreign References:
| JP4009046B2 | 2007-11-14 |
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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