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Title:
THERMOPLASTIC RESIN COMPOSITION, COMMUNICATION DEVICE MEMBER, AND MICROWAVE AND/OR MILLIMETER WAVE COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/054665
Kind Code:
A1
Abstract:
A thermoplastic resin composition that includes a polycarbonate resin having a structural unit (A) represented by formula (1), wherein a hydrolyzate obtained by hydrolyzing the polycarbonate resin includes the dihydroxy compounds represented by formulas (2) to (4), and the sum of the contents of the dihydroxy compound represented by formula (3) and the dihydroxy compound represented by formula (4) in the hydrolyzate is 0.85 mass% or more with respect to the content of the dihydroxy compound represented by formula (2).

Inventors:
TOMITA SHOHEI (JP)
YOKOGI MASASHI (JP)
TABEI HODAKA (JP)
Application Number:
PCT/JP2022/036659
Publication Date:
April 06, 2023
Filing Date:
September 30, 2022
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08G64/04; C08G64/06; C08G64/30; C08L69/00
Domestic Patent References:
WO2007119548A12007-10-25
WO2021039970A12021-03-04
Foreign References:
JP2017082131A2017-05-18
JPH09183894A1997-07-15
JP2003128906A2003-05-08
JP2020193301A2020-12-03
JP2020503190A2020-01-30
JP2017524051A2017-08-24
JP2017522431A2017-08-10
JP2003128906A2003-05-08
JP2019197048A2019-11-14
JP2021160752A2021-10-11
JP2021160753A2021-10-11
JP2022149742A2022-10-07
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
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