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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND FILM MADE FROM THE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/1998/024848
Kind Code:
A1
Abstract:
A thermoplastic resin composition which comprises: (A) 100 parts by weight of a thermoplastic resin, (B) 0.01 to 30 parts by weight of a surfactant, and (C) 0.01 to 30 parts by weight of a functional organic compound having 0.1 to 10 mmol/g functional groups in which two atoms (a and b), bonded to each other have net charges (Ea and Eb), respectively, as calculated by the molecular orbital method. The net charges satisfy the following relationship (1): 0.25$m(F)IEa-EbI$m(F)0.7. When this composition is formed into a film, etc., the product stably retains antistatic performance and antifogging performance from immediately thereafter over long.

Inventors:
OHTA SEIJI
KURISU MASAYOSHI
OHE TATSUYA
NAKAGAWA MIKIO
TAN JUNJI
KASAI TETSUJI
Application Number:
PCT/JP1997/004272
Publication Date:
June 11, 1998
Filing Date:
November 25, 1997
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08J5/18; C08K5/00; C08L23/02; (IPC1-7): C08L101/00; A01G9/14; B32B27/18; B32B27/28; C08J5/18; C08K5/00; C08K5/04; C08L23/00; C08L27/06; C08L57/02; C08L93/04
Foreign References:
JPH0559242A1993-03-09
JPS58101133A1983-06-16
JPS45265B1
JPH0249050A1990-02-19
JPH07166002A1995-06-27
JPH0711062A1995-01-13
Other References:
See also references of EP 0879855A4
Attorney, Agent or Firm:
Suzuki, Shunichiro (Gotanda Yamazaki Building 6F 13-6, Nishigotanda 7-chom, Shinagawa-ku Tokyo 141, JP)
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