Title:
THERMOPLASTIC RESIN COMPOSITION FOR FOAM MOLDING, AND FOAM MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/176316
Kind Code:
A1
Abstract:
This thermoplastic resin composition for foam molding contains a high molecular weight resin (D) having a weight average molecular weight of 2,000,000 or more at a quantity of 0.1-10 parts by mass relative to a total of 100 parts by mass of 1-20 parts by mass of component (A), 0-50 parts by mass of component (B) and 40-90 parts by mass of component (C). Component (A): a rubber-reinforced styrene-based resin (A) obtained by polymerizing a vinyl monomer (b1) including an aromatic vinyl compound in the presence of a rubbery polymer (a). Component (B): a styrene-based resin (B) obtained by polymerizing a vinyl monomer (b2) including an aromatic vinyl compound. Component (C): an aromatic polycarbonate resin (C).
Inventors:
ANDO HIROKI (JP)
HIRAISHI KENTARO (JP)
HIRAISHI KENTARO (JP)
Application Number:
PCT/JP2021/044078
Publication Date:
August 25, 2022
Filing Date:
December 01, 2021
Export Citation:
Assignee:
TECHNO UMG CO LTD (JP)
International Classes:
C08L15/00; C08J9/04; C08L25/08; C08L69/00
Foreign References:
| JP2010254833A | 2010-11-11 | |||
| JP2011037925A | 2011-02-24 | |||
| JP2010116527A | 2010-05-27 | |||
| JP2004051875A | 2004-02-19 | |||
| JP2008127467A | 2008-06-05 | |||
| JP2014118539A | 2014-06-30 | |||
| CN108250660A | 2018-07-06 | |||
| CN112226034A | 2021-01-15 | |||
| JPS4728915B1 | ||||
| JPS473252B1 | ||||
| JPS482423B1 | ||||
| JPS4820038B1 | 1973-06-18 | |||
| JPH02133406A | 1990-05-22 | |||
| JPH02305814A | 1990-12-19 | |||
| JPH0372512A | 1991-03-27 | |||
| JPS428704B1 | 1967-04-20 | |||
| JPS436636B1 | 1968-03-12 | |||
| JPS634841B2 | 1988-02-01 | |||
| JPS635401B2 | 1988-02-03 | |||
| JPH01297413A | 1989-11-30 | |||
| US3419634A | 1968-12-31 | |||
| JP2021026367A | 2021-02-22 |
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
Download PDF: