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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION FOR INSULATION COMPONENTS, AND INSULATION COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/061622
Kind Code:
A1
Abstract:
Provided are: a thermoplastic resin composition for insulation components, which is capable of achieving strength characteristic equivalent to or higher than the GWIT 775˚C standard in almost all test piece thicknesses for insulation components without requiring blending of a special ingredient that is a liquid crystalline polymer or use of a glass fiber at high blending ratio, while having good balance among the strength characteristic, tracking resistance and mechanical characteristics; and an insulating component which uses the thermoplastic resin composition for insulation components. The thermoplastic resin composition for insulation components is characterized by containing (A) a polybutylene terephthalate resin, (B) a halogen flame retardant, (C) a flame retardant assistant, (D) a mineral filler having a moisture content of 20% by mass or more and a dehydration initiation temperature of 300˚C or more and (E) a glass fiber-based reinforcing agent, and is also characterized in that the component (B) is contained in an amount of 15-35 parts by mass per 100 parts by mass of the component (A) and the component (D) is contained in an amount of 2-60 parts by mass per 100 parts by mass of the component (A).

Inventors:
SAWANO SHIN
SHIMODA DAISUKE
Application Number:
PCT/JP2012/053185
Publication Date:
May 02, 2013
Filing Date:
February 10, 2012
Export Citation:
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Assignee:
PANASONIC CORP (JP)
SAWANO SHIN
SHIMODA DAISUKE
International Classes:
H01B3/42; C08K3/38; C08K5/3492; C08K7/14; C08L67/02; H01B17/56
Foreign References:
JP2011032295A2011-02-17
JP2008019400A2008-01-31
JP2012025931A2012-02-09
Attorney, Agent or Firm:
NISHIZAWA TOSHIO (JP)
Toshio Nishizawa (JP)
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Claims: