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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/021894
Kind Code:
A1
Abstract:
This thermoplastic resin composition contains: 10-70 mass% of (A) a rubber-reinforced vinyl-based resin comprising a rubbery portion derived from an acrylic rubbery polymer and a resin portion containing structural units derived from an aromatic vinyl compound and structural units derived from a vinyl cyanide compound; 5-80 mass% of (B) a (meth)acrylic resin (excluding component (A)) comprising a (co)polymer which contains structural units derived from an alkyl (meth)acrylate ester compound and which does not contain structural units derived from α-methylstyrene; and 5-70 mass% of (C) an α-methylstyrene-based resin (excluding component (A)) comprising a (co)polymer which contains structural units derived from α-methylstyrene and which does not contain structural units derived from an alkyl (meth)acrylate ester compound. (The total content of components (A) to (C) is 100 mass%.)

Inventors:
OMATA YUUKI (JP)
FUJIOKA SHINSUKE (JP)
Application Number:
PCT/JP2018/026782
Publication Date:
January 31, 2019
Filing Date:
July 17, 2018
Export Citation:
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Assignee:
TECHNO UMG CO LTD (JP)
International Classes:
C08L33/06; C08L25/16; C08L51/06
Foreign References:
JP2009132776A2009-06-18
JP2007231297A2007-09-13
JP2007169384A2007-07-05
JP2000302937A2000-10-31
US20060148992A12006-07-06
JPS63189455A1988-08-05
JP2003335827A2003-11-28
JP2012214734A2012-11-08
JP2016180096A2016-10-13
Other References:
See also references of EP 3660092A4
Attorney, Agent or Firm:
KOJIMA Seiji (JP)
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