Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/038987
Kind Code:
A1
Abstract:
A thermoplastic resin composition comprising: one or more graft copolymers (B) each obtained by graft-polymerizing a vinyl-based monomer mixture (m1) comprising an alkyl (meth)acrylate, a vinyl cyanide compound, and an aromatic vinyl compound with a copolymer (A) obtained by copolymerizing an alkyl methacrylate (a) and a (meth)acrylic acid ester (b) having an aromatic hydrocarbon group in a specific proportion; and a copolymer (C) which is a product of polymerization of a vinyl-based monomer mixture (m2) including an alkyl (meth)acrylate. The graft copolymers (B) at least include a graft copolymer (B) having a specific volume-average particle diameter. The copolymer (A) has a specific volume-average particle diameter and a specific particle size distribution.
Inventors:
TAGUCHI YUUKI (JP)
NAITOH YOSHITAKA (JP)
NAITOH YOSHITAKA (JP)
Application Number:
PCT/JP2021/028127
Publication Date:
February 24, 2022
Filing Date:
July 29, 2021
Export Citation:
Assignee:
TECHNO UMG CO LTD (JP)
International Classes:
C08F265/06; C08F220/12; C08L33/06; C08L51/06
Domestic Patent References:
| WO2019082715A1 | 2019-05-02 | |||
| WO2020095622A1 | 2020-05-14 |
Foreign References:
| JP2019099698A | 2019-06-24 | |||
| JP2019137751A | 2019-08-22 | |||
| JP2019151697A | 2019-09-12 | |||
| JP2020140254A | 2020-09-03 |
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
Download PDF:
Previous Patent: MOUNTING STRUCTURE, SWITCH, AND GAME CONTROLLER
Next Patent: THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE OF SAME
Next Patent: THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE OF SAME