Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE FORMED FROM SAME
Document Type and Number:
WIPO Patent Application WO/2023/228768
Kind Code:
A1
Abstract:
The present invention provides: a thermoplastic resin composition which is suppressed in discoloration and strength decrease even under harsh processing conditions, thereby achieving excellent recyclability, and which additionally has excellent flame retardancy and excellent stiffness; and a molded article which is formed from this thermoplastic resin composition. A thermoplastic resin composition according to the present invention contains, per 100 parts by weight of (A) a thermoplastic resin (component A), 0.001 part by weight to 1 part by weight of (B) a phosphonate ester (component B) that has an acid value of 0.01 mgKOH/g to 0.30 mgKOH/g.
Inventors:
ONIZAWA TOMOMITSU (JP)
MORI YOSHIAKI (JP)
MITSUNAGA MASAKI (JP)
MORI YOSHIAKI (JP)
MITSUNAGA MASAKI (JP)
Application Number:
PCT/JP2023/017764
Publication Date:
November 30, 2023
Filing Date:
May 11, 2023
Export Citation:
Assignee:
TEIJIN LTD (JP)
International Classes:
C08L101/00; C08K3/013; C08K3/40; C08K5/5333; C08K7/04; C08L55/02; C08L67/00; C08L69/00
Foreign References:
| JP2000327890A | 2000-11-28 | |||
| JP2020094137A | 2020-06-18 | |||
| JP2007154093A | 2007-06-21 | |||
| JP2012188579A | 2012-10-04 | |||
| JP2004175823A | 2004-06-24 | |||
| JP2014028883A | 2014-02-13 | |||
| JP2004018764A | 2004-01-22 | |||
| JPS5670054A | 1981-06-11 | |||
| US20130172471A1 | 2013-07-04 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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