THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY

Title:

THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY

Document Type and Number:

WIPO Patent Application WO/2013/069373

Kind Code:

A1

Abstract:

Provided are: a thermoplastic resin composition containing, with respect to the total amount of component (A) and component (B), (A) 99-50 mass% of a thermoplastic resin, and (B) 1-50 mass% of an acylated lignophenol obtained by acylating a lignophenol having the structure represented by general formula (I); and a molded body using the thermoplastic resin composition.

Inventors:

FUNAOKA MASAMITSU (JP)
AOYAGI MITSURU (JP)
NODERA AKIO (JP)

Application Number:

PCT/JP2012/073671

Publication Date:

May 16, 2013

Filing Date:

September 14, 2012

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Assignee:

IDEMITSU KOSAN CO (JP)
UNIV MIE (JP)
FUNAOKA MASAMITSU (JP)
AOYAGI MITSURU (JP)
NODERA AKIO (JP)

International Classes:

C08L101/00; C08H8/00; C08K5/04; C08L69/00; C08L97/00

Foreign References:

JP2010202712A	2010-09-16
JP2008050446A	2008-03-06
JP2010150424A	2010-07-08
JP2012007143A	2012-01-12

Other References:

MITSURU AOYAGI ET AL.: "Suisanki Shushoku ni yoru Lignophenol no Tainetsusei no Kojo", DAI 59 KAI ABSTRACTS, ANNUAL MEETING OF THE SOCIETY OF POLYMER SCIENCE, 11 May 2010 (2010-05-11), JAPAN, pages 586
MITSURU AOYAGI ET AL.: "Lignophenol Yudotai Tainetsusei Polymer no Tokusei", DAI 60 KAI PROCEEDINGS OF THE THERMOSETTING PLASTICS SYMPOSIUM, 14 October 2010 (2010-10-14), JAPAN, pages 103

Attorney, Agent or Firm:

OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)

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