Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED PART USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/081318
Kind Code:
A2
Abstract:
Disclosed are a thermoplastic resin composition and a molded part using same. The thermoplastic resin composition comprises: (A) a base resin including (A-1) a poly(alkyl methacrylate) resin and (A-2) a vinyl-based copolymer; and (B) a copolymer having a core-shell structure, in which a copolymer of at least two compounds selected from an aromatic vinyl compound, cyanic vinyl compound, and acrylic compound is grafted onto a gum polymer.
Inventors:
CHU DONG-HUI
HA DOO-HAN
KIM IN-CHOL
JIN SUNG-HUN
HA DOO-HAN
KIM IN-CHOL
JIN SUNG-HUN
Application Number:
PCT/KR2010/008810
Publication Date:
July 07, 2011
Filing Date:
December 09, 2010
Export Citation:
Assignee:
CHEIL IND INC
CHU DONG-HUI
HA DOO-HAN
KIM IN-CHOL
JIN SUNG-HUN
CHU DONG-HUI
HA DOO-HAN
KIM IN-CHOL
JIN SUNG-HUN
International Classes:
C08L33/12; C08J5/00; C08L51/04; C08L55/02
Foreign References:
| KR20090084574A | 2009-08-05 | |||
| KR100474817B1 | 2005-03-10 | |||
| US4393164A | 1983-07-12 | |||
| KR100799605B1 | 2008-01-30 |
Attorney, Agent or Firm:
PANKOREA PATENT AND LAW FIRM (KR)
팬코리아 특허법인 (KR)
팬코리아 특허법인 (KR)
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