Title:
THERMOPLASTIC RESIN COMPOSITION, MOLDED PRODUCT, METAL FOIL LAMINATED BOARD, BONDING SHEET, FILAMENT, AND MATERIAL FOR THREE-DIMENSIONAL FABRICATION
Document Type and Number:
WIPO Patent Application WO/2024/014123
Kind Code:
A1
Abstract:
This thermoplastic resin composition contains: a crystalline thermoplastic polyimide resin (A) which contains a repeating constituent unit represented by formula (1) and a repeating constituent unit represented by formula (2) and in which the content of the repeating constituent unit represented by formula (1) is 15-70 mol% relative to the total amount of the repeating constituent unit represented by formula (1) and the repeating constituent unit represented by formula (2); and a polyetherketoneketone resin (B). The absolute value of the difference between the melting point TmA of component (A) and the melting point TmB of component (B), i.e., TmA-TmB| is 0-40ºC. (R1 is a C6-C22 divalent group which comprises at least one alicyclic hydrocarbon structure; R2 is a C5-C16 divalent chain aliphatic group; and X1 and X2 are each independently a C6-C22 tetravalent group which comprises at least one aromatic ring.)
Inventors:
SAKAI ATSUSHI (JP)
FUJII RYOSUKE (JP)
SATO YUUKI (JP)
KANEKO NAOKI (JP)
FUJII RYOSUKE (JP)
SATO YUUKI (JP)
KANEKO NAOKI (JP)
Application Number:
PCT/JP2023/018691
Publication Date:
January 18, 2024
Filing Date:
May 19, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
B32B15/088; C08L79/08; B33Y70/00; C08G73/10; C08L101/00; C09J7/35; C09J171/00; C09J179/04
Domestic Patent References:
| WO2019220969A1 | 2019-11-21 | |||
| WO2016147996A1 | 2016-09-22 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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