THERMOPLASTIC RESIN COMPOSITION - ASAHI CHEMICAL IND

Title:

THERMOPLASTIC RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2003/000788

Kind Code:

A1

Abstract:

A thermoplastic resin composition which comprises (A) a styrene resin and&sol or polyphenylene ether resin, (B) an olefin resin, and (C) a partially hydrogenated block copolymer, the ingredient (C) being contained in an amount of 2 to 30 parts by weight per 100 parts by weight of the sum of the ingredients (A) and (B), wherein the ingredient (C) is a partially hydrogenated block copolymer obtained from a block copolymer which has a polymer block (X) consisting mainly of units of a vinylaromatic compound and a polymer block (Y) consisting mainly of units of a conjugated diene compound and has a combined vinylaromatic content of 30 to 80 wt.% and a combined vinyl content in the polymer block (Y) of 20 to 65 wt.%, excluding 65 wt.%, by hydrogenating 35 to 70%, excluding 70%, of the double bonds attributable to the conjugated diene compound in the polymer block (Y). It is satisfactory in heat resistance, oil resistance, and thermal aging resistance.

Inventors:

SASAGAWA MASAHIRO (JP)
SUZUKI KATSUMI (JP)
HOSHINA TOSHIKAZU (JP)

Application Number:

PCT/JP2001/005281

Publication Date:

January 03, 2003

Filing Date:

June 20, 2001

Export Citation:

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Assignee:

ASAHI CHEMICAL IND (JP)
SASAGAWA MASAHIRO (JP)
SUZUKI KATSUMI (JP)
HOSHINA TOSHIKAZU (JP)

International Classes:

A61K31/5513; A61K31/553; A61P1/04; A61P3/10; A61P9/10; A61P11/06; A61P13/12; A61P19/02; A61P25/00; A61P29/00; A61P35/00; A61P37/06; A61P37/08; A61P43/00; C07D243/24; C07D491/052; C08L23/02; C08L25/06; C08L71/12; C08L53/02; (IPC1-7): C08L23/02; C08L25/00; C08L71/12

Foreign References:

JP2000344974A	2000-12-12
JPH1171466A	1999-03-16
JPH1112406A	1999-01-19
JPH1112404A	1999-01-19
JPH0859954A	1996-03-05
JPH06192493A	1994-07-12
JPH06192502A	1994-07-12

Other References: