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Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/015430
Kind Code:
A1
Abstract:
The present invention provides a thermoplastic resin composition, which contains (A) a thermoplastic resin, (B) a compound represented by formula (I), and (C) a carbon black, and wherein the component (C) is contained in an amount of 2-250 parts by weight per 1 part by weight of the component (B). (In the formula, each of R1, R2, R5, R6, R7 and R8 represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkylcycloalkyl group, an aralkyl group or a phenyl group; each of R3 and R4 represents a hydrogen atom or an alkyl group; X1 represents a single bond, a sulfur atom or a -CHR9- group; R9 represents a hydrogen atom, an alkyl group or a cycloalkyl group; A1 represents an alkanediyl group or a *-COR10- group; R10 represents a single bond or an alkanediyl group; * represents a bonding hand with -O-; and one of Y1 and Z1 represents a hydroxyl group, an alkoxy group or an aralkyloxy group, and the other represents a hydrogen atom or an alkyl group.)

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Inventors:
SATO NATSUKO (JP)
Application Number:
PCT/JP2012/069266
Publication Date:
January 31, 2013
Filing Date:
July 23, 2012
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
SATO NATSUKO (JP)
International Classes:
C08L101/00; C08K3/04; C08K5/524
Domestic Patent References:
WO2011078198A12011-06-30
Foreign References:
JP2003268123A2003-09-25
JP2001106832A2001-04-17
JP2002212347A2002-07-31
JP2006160809A2006-06-22
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
Nakayama δΊ¨ (JP)
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Claims: