Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMORESPONSIVE COMPOSITION AND THERMORESPONSIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/190229
Kind Code:
A1
Abstract:
One embodiment of the present invention provides a thermoresponsive composition and a thermosresponsive material that contain microcapsules and a coloring material. The microcapsules have a number average wall thickness of 10–200 nm and encapsulate: a coloring pigment that is the product of reacting an electron-donating dye precursor and an electron-accepting compound that causes the electron-donating dye precursor to become colored; and a discoloration-temperature regulator. The coloring material is on the inside and/or the outside of the microcapsules.

Inventors:
KAWAKAMI HIROSHI (JP)
Application Number:
PCT/JP2018/014486
Publication Date:
October 18, 2018
Filing Date:
April 04, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09K9/02; C09B11/28; C09B67/08
Domestic Patent References:
WO2016194915A12016-12-08
Foreign References:
JP2014213543A2014-11-17
JP2012077261A2012-04-19
JP2009166310A2009-07-30
JP2009067863A2009-04-02
JP2005089576A2005-04-07
JP2004359762A2004-12-24
JP2004255632A2004-09-16
JP2012158621A2012-08-23
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF: