Title:
THERMOSETTING ADHESIVE COMPOSITION AND THERMOSETTING ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2016/076356
Kind Code:
A1
Abstract:
Provided are a thermosetting adhesive composition that exhibits stable electrical conductivity even in high-temperature environments and high-temperature high-humidity environments; and a thermosetting adhesive sheet. A thermosetting adhesive sheet (20) contains: an acrylic copolymer which is obtained by copolymerizing 55-80 wt.% of an alkyl (meth)acrylate, 15-30 wt.% of acrylonitrile, and 5-15 wt.% of glycidyl methacrylate; an epoxy resin; an epoxy resin curing agent; and a dendritic electrically conductive filler having a tap density of 1.0-1.8 g/cm3. Because thermal expansion following curing is suppressed and the number of electrical contacts in the electrically conductive filler is increased by this composition, it is possible to achieve stable electrical conductivity even in high-temperature environments and high-temperature high-humidity environments.
Inventors:
NATORI TOSHIKI (JP)
Application Number:
PCT/JP2015/081737
Publication Date:
May 19, 2016
Filing Date:
November 11, 2015
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J133/06; C09J7/10; C09J9/02; C09J11/04; C09J11/06; C09J163/00
Domestic Patent References:
| WO2012164925A1 | 2012-12-06 | |||
| WO2000009623A1 | 2000-02-24 | |||
| WO2012073703A1 | 2012-06-07 | |||
| WO2013183486A1 | 2013-12-12 |
Foreign References:
| JP2006022230A | 2006-01-26 | |||
| JP2008308682A | 2008-12-25 | |||
| JP2011079959A | 2011-04-21 |
Attorney, Agent or Firm:
NOGUCHI, NOBUHIRO (JP)
Nobuhiro Noguchi (JP)
Nobuhiro Noguchi (JP)
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