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Title:
THERMOSETTING ADHESIVE SHEET AND FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2013/002004
Kind Code:
A1
Abstract:
Provided is a thermosetting adhesive sheet having a thermosetting adhesive agent layer which, after being cured, can achieve excellent adhesiveness and extremely high heat resistance after exposure to humidity and heat. This thermosetting adhesive sheet is characterized by having a thermosetting adhesive agent layer that is formed from a thermosetting adhesive agent composition containing an acrylic polymer (X), an etherified phenolic resin (Y), and a silica filler (Z1) and/or a copper filler (Z2). The acrylic polymer (X) is preferably an acrylic polymer formed by employing, as an essential monomer component, a (meth)acrylic acid alkyl ester (a) including a straight-chain or branched alkyl group with a carbon number of 1 to 14.

Inventors:
KUWAHARA RIE (JP)
DAIGAKU NORITSUGU (JP)
HORIGUCHI HAKARU (JP)
FURUTA YOSHIHISA (JP)
Application Number:
PCT/JP2012/064680
Publication Date:
January 03, 2013
Filing Date:
June 07, 2012
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
KUWAHARA RIE (JP)
DAIGAKU NORITSUGU (JP)
HORIGUCHI HAKARU (JP)
FURUTA YOSHIHISA (JP)
International Classes:
C09J7/10; C09J11/04; C09J133/00; C09J133/02; C09J133/08; C09J133/10; C09J171/12; H05K1/03
Foreign References:
JP2005247910A2005-09-15
JP2006283002A2006-10-19
JP2006169288A2006-06-29
Attorney, Agent or Firm:
GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)
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Claims:



 
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