Title:
THERMOSETTING ADHESIVE SHEET AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2013/073380
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a thermosetting adhesive sheet which exhibits excellent adhesiveness and excellent heat resistance after exposure to humidity and heat even in cases where the curing time is short, while having excellent thermal conductivity. A thermosetting adhesive sheet of the present invention has a thermosetting adhesive layer that is formed from a thermosetting adhesive composition, and is characterized in that: the thermosetting adhesive composition contains an acrylic polymer (X) as a main component; the thermosetting adhesive composition also contains an etherified phenolic resin (Y); and the thermosetting adhesive layer has a thickness of 1-20 μm.
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Inventors:
KUWAHARA RIE (JP)
NONAKA TAKAHIRO (JP)
DAIGAKU NORITSUGU (JP)
HORIGUCHI HAKARU (JP)
NONAKA TAKAHIRO (JP)
DAIGAKU NORITSUGU (JP)
HORIGUCHI HAKARU (JP)
Application Number:
PCT/JP2012/078316
Publication Date:
May 23, 2013
Filing Date:
November 01, 2012
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B27/30; C09J7/10; C09J133/00; C09J133/06; C09J133/14; C09J161/06; H05K1/03
Domestic Patent References:
| WO2011004710A1 | 2011-01-13 |
Foreign References:
| JP2012051994A | 2012-03-15 | |||
| JP2005247910A | 2005-09-15 | |||
| JP2005239830A | 2005-09-08 | |||
| JP2007049036A | 2007-02-22 |
Attorney, Agent or Firm:
GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)
Yukihisa Goto (JP)
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Claims: