Title:
THERMOSETTING COMPOSITION AND CONDUCTIVE ADHESIVE USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/090759
Kind Code:
A1
Abstract:
[Problem] To provide a thermosetting composition which, when being cured quickly at a high temperature (within one minute at 100-150°C), can achieve the ability to avoid sudden boiling, and the ability of fast curing ability. [Solution] This thermosetting composition contains components (A)-(C), wherein component (A) is a compound having a (meth)acrylic group, component (B) is a phenolic compound that has a molecular weight of 230 or more and is soluble in component (A), and component (C) is an organic peroxide having a specific structure.
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Inventors:
OTA SOICHI (JP)
MAFUNE HITOSHI (JP)
KATO MAKOTO (JP)
KODAMA TOMOYA (JP)
OSADA MASAYUKI (JP)
MAFUNE HITOSHI (JP)
KATO MAKOTO (JP)
KODAMA TOMOYA (JP)
OSADA MASAYUKI (JP)
Application Number:
PCT/JP2016/085071
Publication Date:
June 01, 2017
Filing Date:
November 25, 2016
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C08F2/44; C08F4/34; C08F290/06; C09J4/02; C09J9/02; C09J11/04; C09J11/06
Domestic Patent References:
| WO2005061615A1 | 2005-07-07 | |||
| WO2002057357A1 | 2002-07-25 |
Foreign References:
| JP2013107932A | 2013-06-06 | |||
| JP2008520760A | 2008-06-19 | |||
| JP2003064111A | 2003-03-05 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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