Title:
THERMOSETTING COMPOSITION FOR INJECTION MOLDING, METHOD FOR PRODUCING MOLDED ARTICLE USING SAME, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/215715
Kind Code:
A1
Abstract:
This thermosetting composition for injection molding contains (A) a compound represented by formula (A2) or (A3) as well as (B) a thermal polymerization initiator, and also does of does not contain (G) titanium oxide. If component (G) is included, the content thereof is 5 parts by mass or less with respect to a total of 100 parts by mass of components other than the component (B) and the component (G), and the composition does not contain polybutadiene di(meth)acrylate.
Inventors:
OBATA YUTAKA (JP)
OKADA YASUNARI (JP)
ITO KATSUKI (JP)
WATANABE KAZUKI (JP)
OKADA YASUNARI (JP)
ITO KATSUKI (JP)
WATANABE KAZUKI (JP)
Application Number:
PCT/JP2022/017207
Publication Date:
October 13, 2022
Filing Date:
April 06, 2022
Export Citation:
Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
B29C45/03; B29C45/28; C08F20/20; C08F299/02
Domestic Patent References:
| WO2009005036A1 | 2009-01-08 |
Foreign References:
| JP2012131074A | 2012-07-12 | |||
| JP2019011447A | 2019-01-24 | |||
| JPH11345504A | 1999-12-14 | |||
| JP2005074896A | 2005-03-24 |
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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