Title:
THERMOSETTING COMPOSITION FOR INJECTION MOLDING, PRODUCTION METHOD FOR MOLDED ARTICLE USING SAME, AND CURED OBJECT
Document Type and Number:
WIPO Patent Application WO/2022/215711
Kind Code:
A1
Abstract:
A thermosetting composition for injection molding that includes: (A) a di(meth)acrylate compound that has a structural unit that is represented by formula (A1); and (B) a thermal polymerization initiator.
Inventors:
OBATA YUTAKA (JP)
OKADA YASUNARI (JP)
ITO KATSUKI (JP)
WATANABE KAZUKI (JP)
OKADA YASUNARI (JP)
ITO KATSUKI (JP)
WATANABE KAZUKI (JP)
Application Number:
PCT/JP2022/017201
Publication Date:
October 13, 2022
Filing Date:
April 06, 2022
Export Citation:
Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
B29C45/00; B29C45/28; C08F290/06; C08F299/04
Domestic Patent References:
| WO2019235465A1 | 2019-12-12 |
Foreign References:
| JP2012214640A | 2012-11-08 | |||
| JP2012072328A | 2012-04-12 | |||
| JP2020094208A | 2020-06-18 | |||
| JP2010138248A | 2010-06-24 | |||
| JP2021191820A | 2021-12-16 |
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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