Title:
THERMOSETTING COMPOSITION, METHOD FOR PRODUCING MOLDED ARTICLE USING SAME, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/215708
Kind Code:
A1
Abstract:
A thermosetting composition which contains (A) a di(meth)acrylate compound that has a structural unit represented by formula (A1), (B) a thermal polymerization initiator and (E) an inorganic filler.
Inventors:
OBATA YUTAKA (JP)
OKADA YASUNARI (JP)
ITO KATSUKI (JP)
WATANABE KAZUKI (JP)
OKADA YASUNARI (JP)
ITO KATSUKI (JP)
WATANABE KAZUKI (JP)
Application Number:
PCT/JP2022/017189
Publication Date:
October 13, 2022
Filing Date:
April 06, 2022
Export Citation:
Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
B29C45/00; B29C45/28; C08F290/06; C08F299/04
Foreign References:
| JP2019077740A | 2019-05-23 | |||
| JP2016109996A | 2016-06-20 | |||
| JP2016024243A | 2016-02-08 | |||
| US7723461B1 | 2010-05-25 |
Attorney, Agent or Firm:
HEIWA INTERNATIONAL PATENT OFFICE (JP)
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