THERMOSETTING POLYPHENYLENE ETHER RESIN COMPOSITION, CURED RESIN COMPOSITION OBTAINED THEREFROM, AND LAMINATED STRUCTURE

WIPO Patent Application WO/1999/042523

A1

A curable polyphenylene ether resin (PPE) composition which comprises (a) a PPE and (b) a compound having a 3,4-dihydro-3-substituted-1,3-benzoxazine skeleton or a mixture thereof with a polymer thereof formed by ring-opening polymerization; a cured PPE composition obtained by curing the curable PPE composition; and a laminated structure containing the curable or cured PPE composition. The curable PPE composition gives a cured composition excellent in chemical resistance, moisture resistance, dielectric properties, heat resistance, flame retardancy, and dimensional stability. The cured composition is hence usable as dielectric, insulating, and heat-resistant materials or the like in fields such as the electrical/electronic industry and the space/airplane industry. The curable composition is advantageously usable especially as a resin composition for forming insulating layers in, e.g., printed circuit boards having a circuit layer on one side or on each side or having many circuit layers, flexible printed circuit boards, semirigid substrates, and substrates having excellent radiating properties.

KATO AKIHIRO (JP)
KINOSHITA SHOZO (JP)

PCT/JP1999/000813

August 26, 1999

February 23, 1999

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ASAHI CHEMICAL IND (JP)
KATO AKIHIRO (JP)
KINOSHITA SHOZO (JP)

C08J5/18; C08L71/12; H01B3/42; H05K1/03; (IPC1-7): C08L71/12; C08L61/34; H05K1/03; C08G65/48; C08G14/06; C08J5/18; B32B27/00

JPH091728A	1997-01-07
JPH07329087A	1995-12-19
JPH1025343A	1998-01-27
JPH02166115A	1990-06-26
JPH09246429A	1997-09-19
JPH1060371A	1998-03-03
EP0875531A2	1998-11-04

See also references of EP 1063262A4

Yoshioka, Masashi (Akasaka 1-chome Minato-ku Tokyo, JP)

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