Title:
THERMOSETTING RESIN COMPOSITION, RESIN ADHESIVE LIQUID CONTAINING SAME, PREPREG, LAMINATE, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/134215
Kind Code:
A1
Abstract:
The present invention relates to a thermosetting resin composition, a resin adhesive liquid containing same, a prepreg, a laminate, a copper clad laminate and a printed circuit board. The thermosetting resin composition comprises the following components: a thermosetting polyphenylene ether resin, an unsaturated butadiene styrene resin, a polyfunctional vinyl aromatic copolymer, an initiator, a silane coupling agent and a filler. The polyfunctional vinyl aromatic copolymer is a copolymer obtained by copolymerizing a divinyl aromatic compound (a), styrene (b), and a monovinyl aromatic compound (c) other than styrene. On the basis of 100 parts by weight of the sum of the amounts of the thermosetting polyphenylene ether resin and the unsaturated butadiene styrene resin, the amount of the multifunctional vinyl aromatic copolymer is 5-25 parts by weight. The board prepared by the thermosetting resin composition provided by the present invention has a relatively high glass transition temperature and a relatively low coefficient of thermal expansion, and has comprehensive properties such as a low dielectric constant, a low dielectric loss, high flame retardancy, and a high peel strength.
Inventors:
CHEN YUHANG (CN)
ZENG XIANPING (CN)
GUAN CHIJI (CN)
ZENG XIANPING (CN)
GUAN CHIJI (CN)
Application Number:
PCT/CN2021/070438
Publication Date:
June 30, 2022
Filing Date:
January 06, 2021
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L71/12; B32B9/00; B32B9/04; B32B15/14; B32B15/20; B32B17/02; B32B17/12; B32B27/02; B32B27/04; B32B27/12; B32B27/34; C08J5/24; C08K3/36; C08K5/5435; C08K7/14; C08K13/04; C08L25/02; C08L25/10; H05K1/03
Foreign References:
| CN1914239A | 2007-02-14 | |||
| JP2006089683A | 2006-04-06 | |||
| JP2006070136A | 2006-03-16 | |||
| JP2007262191A | 2007-10-11 | |||
| JP2008248001A | 2008-10-16 | |||
| CN109385021A | 2019-02-26 | |||
| CN109385018A | 2019-02-26 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
Download PDF:
Previous Patent: CONTINUOUS ELECTROPHORETIC DEPOSITION MODIFIED CARBON FIBER REINFORCED MULTI-MATRIX COMPOSITE MATERI...
Next Patent: VIBRATION MOTOR
Next Patent: VIBRATION MOTOR