Title:
THERMOSETTING RESIN COMPOSITION, CURED MATERIAL THEREOF, AND PRINTED WIRING BOARD USING CURED MATERIAL
Document Type and Number:
WIPO Patent Application WO/2011/122161
Kind Code:
A1
Abstract:
Disclosed is a thermosetting resin composition capable of realizing a cured material which has good storage stability and resolution and also has good flex resistance, coat hardness, and electrical insulation. Also disclosed are a cured material of the thermosetting resin composition and a printed wiring board using the cured material. The thermosetting resin composition comprises (A) a solid epoxy resin having a structure of general formula (i), (B) an acid anhydride curing agent, (C) a curing accelerator, and (D) a powdered urethane resin. The amount of an acid anhydride in the acid anhydride curing agent is within a range of 0.5 to 1.5 equivalent per equivalent of an epoxy group contained in the solid epoxy resin. In formula (i), X represents -CH2- or -C(CH3)2-, Y represents a group of formula (I) or (II), Z represents a hydrogen atom or a glycidyl group, and n represents an integer of 1 to 12.
Inventors:
HARASHIMA KEITA (JP)
TAKEBAYASHI YOSHIKI (JP)
HIROSE MASATO (JP)
TAKEBAYASHI YOSHIKI (JP)
HIROSE MASATO (JP)
Application Number:
PCT/JP2011/053648
Publication Date:
October 06, 2011
Filing Date:
February 21, 2011
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
HARASHIMA KEITA (JP)
TAKEBAYASHI YOSHIKI (JP)
HIROSE MASATO (JP)
HARASHIMA KEITA (JP)
TAKEBAYASHI YOSHIKI (JP)
HIROSE MASATO (JP)
International Classes:
C08L63/00; C08G59/42; C08K3/36; C08L75/04; H05K1/03
Domestic Patent References:
| WO2000056798A1 | 2000-09-28 |
Foreign References:
| JPH0964545A | 1997-03-07 | |||
| JP2010001465A | 2010-01-07 | |||
| JP2010037352A | 2010-02-18 |
Attorney, Agent or Firm:
EMURA Yoshihiko et al. (JP)
Yoshihiko Emura (JP)
Yoshihiko Emura (JP)
Download PDF:
Claims: