Title:
THERMOSETTING RESIN COMPOSITION, DRY FILM, CURED PRODUCT, PRINTED WIRING BOARD, AND ELECTRIC/ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/202427
Kind Code:
A1
Abstract:
[Problem] To provide a thermosetting resin composition capable of easily individualizing chips by a step for individualizing chips one-by-one after batch sealing a plurality of chips using a thermosetting resin composition in production of a SAW filter. [Means] The thermosetting resin composition according to the present invention includes a thermosetting resin and is characterized in that a cured product obtained by heating and curing the thermosetting resin composition for 60 minutes at 180°C after heating for 30 minutes at 100°C satisfies the following conditions: (i) the breaking point strength is 100 MPa or less, (ii) the linear expansion coefficient is 35 ppm/°C or less, and (iii) the storage modulus at 30°C is 2 GPa or more.
Inventors:
KANAZAWA YASUYO (JP)
GUAN ZHONG (JP)
NAKAI KOSHIN (JP)
NAKADA KAZUTAKA (JP)
GUAN ZHONG (JP)
NAKAI KOSHIN (JP)
NAKADA KAZUTAKA (JP)
Application Number:
PCT/JP2022/011180
Publication Date:
September 29, 2022
Filing Date:
March 14, 2022
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08L101/00; C08K3/013; C08L63/00; H03H3/08; H03H9/25; H05K3/00; H05K3/28
Domestic Patent References:
| WO2019163292A1 | 2019-08-29 | |||
| WO2017110342A1 | 2017-06-29 | |||
| WO2018199306A1 | 2018-11-01 |
Foreign References:
| JPH10178053A | 1998-06-30 | |||
| JPH10178054A | 1998-06-30 | |||
| JP2002146310A | 2002-05-22 | |||
| JP2003221509A | 2003-08-08 | |||
| JP2014189790A | 2014-10-06 |
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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