Title:
THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN FILM, THERMOSET FILM, MULTILAYER BODY, PRINTED WIRING BOARD AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/020542
Kind Code:
A1
Abstract:
A thermosetting resin composition according to the present invention contains: a compound that has an imide group and a carboxy group in each molecule (component (A)); and a polymer that has a repeating unit represented by general formula (1) (component (B)). In the formula, each of R1 and R2 independently represents a hydrogen atom or a methyl group; each R3 represents a hydrogen atom or an arbitrary substituent, and a plurality of R3 moieties may combine with each other to form a ring structure; R4 represents a hydrogen atom or an alkyl group;
and each of m and n independently represents an integer of 1 or more, and m/n is preferably within the range from 1 to 50.
Inventors:
KONO FUMIYA (JP)
KIDO MASAYOSHI (JP)
KIDO MASAYOSHI (JP)
Application Number:
PCT/JP2020/029365
Publication Date:
February 04, 2021
Filing Date:
July 30, 2020
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08G81/02; C08G18/44; C08G18/65; C08G18/75; C08G18/83; C08L25/08; C08L75/04; H05K1/03; H05K3/46
Domestic Patent References:
| WO2017188155A1 | 2017-11-02 | |||
| WO2009147938A1 | 2009-12-10 | |||
| WO2014010524A1 | 2014-01-16 |
Foreign References:
| JPH1192617A | 1999-04-06 | |||
| JP2014065886A | 2014-04-17 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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