THERMOSETTING RESIN COMPOSITION, HIGH FREQUENCY DEVICE, DIELECTRIC SUBSTRATE, AND MICROSTRIP ANTENNA

WIPO Patent Application WO/2022/202781

A1

A thermosetting resin composition according to the present invention comprises: a thermosetting resin, a high dielectric constant filler having a specific dielectric constant at 25ºC and 25 GHz of 10 or higher; and an active ester compound, and when the flexural modulus of elasticity at 25ºC is denoted by FM25, and the flexural modulus of elasticity at 260ºC is denoted by FM260, FM25 and FM260 satisfy 0.005 ≤ FM260/FM25 ≤ 0.1. Moreover, the thermosetting resin composition according to the present invention comprises an epoxy resin (A), a curing agent (B), and a high dielectric constant filler (C). The epoxy resin (A) includes a biphenyl aralkyl-type epoxy resin and/or a biphenyl-type epoxy resin (excluding biphenyl aralkyl-type epoxy resins). The curing agent (B) includes an active ester-based curing agent and a phenol-based curing agent. The high dielectric constant filler (C) includes at least one type selected from calcium titanate, barium titanate, strontium titanate, magnesium titanate, magnesium zirconate, strontium zirconate, bismuth titanate, zirconium titanate, zinc titanate, barium zirconate, calcium zirconate-titanate, lead zirconate-titanate, barium magnesium niobate, and calcium zirconate, and the high dielectric constant filler (C) is contained at an amount of 30 mass% or higher in 100 mass% of the thermosetting resin composition.

KIMURA SHUNJI (JP)
TANAKA TSUYOSHI (JP)

PCT/JP2022/013057

September 29, 2022

March 22, 2022

Click for automatic bibliography generation  

SUMITOMO BAKELITE CO (JP)

C08G59/40; C08K3/013; C08K3/10; C08K3/22; C08K3/24; C08K5/10; C08L61/10; C08L63/00; C08L65/00; C08L67/03; C08L101/00; H01P3/16; H01Q13/08

JP6870778B1	2021-05-12
CN103351578A	2013-10-16

HAYAMI Shinji (JP)

View/Download PDF      PDF Help

Previous Patent: DISPLAY CONTROL DEVICE

Next Patent: ORGANIC EL DISPLAY DEVICE, AND METHOD FOR MANUFACTURING SAME