Title:
THERMOSETTING RESIN COMPOSITION, MOLDED ARTICLE, MOLDING MATERIAL FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/219007
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a thermosetting resin composition that enables control of resin flow time and curing rate and that has high breakage toughness and elastic modulus when being subjected to moist heat; and a fiber-reinforced composite material formed of the epoxy resin composition. The present invention pertains to a thermosetting resin composition containing components [A], [B], [C], and [D]. [A] An epoxy resin.
[B] An isocyanate compound.
[C] A catalyst.
[D] A sulfone amide compound represented by formula (I) (In formula (I), R1 represents a linear or branched alkyl group that has 1-10 carbon atoms and that is substituted or unsubstituted, or a substituted or unsubstituted cycloalkyl or aryl ring.
R2 represents hydrogen or a linear or branched alkyl group that has 1-10 carbon atoms and that is substituted or unsubstituted.)
Inventors:
SUZUKI MAKOTO (JP)
KONISHI DAISUKE (JP)
TSUCHIDA HIROYA (JP)
HIRANO NORIYUKI (JP)
KONISHI DAISUKE (JP)
TSUCHIDA HIROYA (JP)
HIRANO NORIYUKI (JP)
Application Number:
PCT/JP2023/016826
Publication Date:
November 16, 2023
Filing Date:
April 28, 2023
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G18/00; C08G18/08; C08G18/16; C08G18/58; C08G59/40; C08J5/04; C08K5/435; C08K7/02; C08L63/00; C08L75/04
Domestic Patent References:
| WO2022102467A1 | 2022-05-19 | |||
| WO2022124191A1 | 2022-06-16 |
Foreign References:
| JPH02289609A | 1990-11-29 | |||
| CN108841286A | 2018-11-20 | |||
| CN112662090A | 2021-04-16 | |||
| JP2006241187A | 2006-09-14 |
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