Title:
THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/162989
Kind Code:
A1
Abstract:
Provided is a thermosetting resin composition exhibiting no adhesiveness between prepregs despite containing a compound that has a structural unit derived from a conjugated diene compound. Also provided are a prepreg, a resin film, a laminated board, a printed wiring board, and a semiconductor package that are obtained using the thermosetting resin composition. Specifically, this thermosetting resin composition is as follows. The thermosetting resin composition contains (A) a thermosetting resin and (B) a compound having a structural unit (b1) derived from a conjugated diene compound, wherein the content of the structural unit (b1) derived from a conjugated diene compound is less than 14.0% by mass based on the total amount of resin components in the thermosetting resin composition.
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Inventors:
UENO FUMITAKA (JP)
NAKAMURA YUKIO (JP)
YANAGIDA MAKOTO (JP)
IWANAGA KOHTA (JP)
NAKAMURA SHOTA (JP)
FUJIYASU YOSUKE (JP)
MATSUOKA SHIORI (JP)
NAKAMURA YUKIO (JP)
YANAGIDA MAKOTO (JP)
IWANAGA KOHTA (JP)
NAKAMURA SHOTA (JP)
FUJIYASU YOSUKE (JP)
MATSUOKA SHIORI (JP)
Application Number:
PCT/JP2023/006270
Publication Date:
August 31, 2023
Filing Date:
February 21, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08L101/00; B32B15/08; C08J5/24; C08K3/013; C08L9/06; H05K1/03
Domestic Patent References:
| WO2016175326A1 | 2016-11-03 | |||
| WO2020204175A1 | 2020-10-08 |
Foreign References:
| JP2021138849A | 2021-09-16 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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