Title:
THERMOSETTING RESIN COMPOSITION, AND PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/134945
Kind Code:
A1
Abstract:
Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.
Inventors:
HUANG ZENGBIAO (CN)
FAN HUAYONG (CN)
XU YONGJING (CN)
HUANG JIANLONG (CN)
SHE NAIDONG (CN)
FAN HUAYONG (CN)
XU YONGJING (CN)
HUANG JIANLONG (CN)
SHE NAIDONG (CN)
Application Number:
PCT/CN2020/082287
Publication Date:
July 08, 2021
Filing Date:
March 31, 2020
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L51/06; C08L47/00; C08L71/12; H05K1/03
Foreign References:
| CN108623974A | 2018-10-09 | |||
| CN1854173A | 2006-11-01 | |||
| CN108148332A | 2018-06-12 | |||
| CN101115348A | 2008-01-30 | |||
| CN108395538A | 2018-08-14 | |||
| CN109294223A | 2019-02-01 | |||
| CN103467967A | 2013-12-25 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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