Title:
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2021/149698
Kind Code:
A1
Abstract:
The present invention relates to: a thermosetting resin composition which contains (a) a compound that has at least one N-substituted maleimide group, (b) a compound that has at least two unsaturated aliphatic hydrocarbon groups, and (c) a benzoxazine compound; a prepreg which uses this thermosetting resin composition; a laminate; a printed wiring board; and a semiconductor package.
Inventors:
SAKAMOTO NORIHIKO (JP)
SATOH TSUTOMU (JP)
OTSUKA KOHEI (JP)
SHIMAOKA SHINJI (JP)
OSE MASAHISA (JP)
SATOH TSUTOMU (JP)
OTSUKA KOHEI (JP)
SHIMAOKA SHINJI (JP)
OSE MASAHISA (JP)
Application Number:
PCT/JP2021/001766
Publication Date:
July 29, 2021
Filing Date:
January 20, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08L61/34; B32B27/00; B32B27/38; H05K1/03; H05K3/46
Domestic Patent References:
| WO2019078300A1 | 2019-04-25 | |||
| WO2010055811A1 | 2010-05-20 |
Foreign References:
| JP2019099755A | 2019-06-24 | |||
| JP2016132738A | 2016-07-25 | |||
| JP2017149859A | 2017-08-31 | |||
| JP2015017158A | 2015-01-29 | |||
| JP2014523953A | 2014-09-18 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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