Title:
THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRING BOARD, AND RESIN COMPOSITION FOR PRINTED WIRING BOARD SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/145960
Kind Code:
A1
Abstract:
The present disclosure provides a thermosetting resin composition, or the like, from which a cured product having excellent dielectric characteristics with respect to high-frequency radio waves is obtained. Disclosed is a thermosetting resin composition or the like which contains a thermosetting resin having a plurality of ethylenically unsaturated groups in a single molecule, wherein: the ethylenically unsaturated groups are carbon-carbon double bonds containing two carbon atoms, and when the total number of the ethylenically unsaturated groups is set to be 100%, the ratio of the number of ethylenically unsaturated groups in which both of the two carbon atoms are bonded to one or two atoms other than hydrogen atoms via single bonds is 50% or more; and a dielectric loss tangent at 40 GHz of a cured product of the curable resin composition is smaller than a dielectric loss tangent at 10 GHz of the cured product.
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Inventors:
ITO DAISUKE (JP)
ISHIKAWA SHINSUKE (JP)
FUJIOKA YUICHI (JP)
MUTSUDA MITSUTERU (JP)
KITAGAWA TOMOKI (JP)
ISHIKAWA SHINSUKE (JP)
FUJIOKA YUICHI (JP)
MUTSUDA MITSUTERU (JP)
KITAGAWA TOMOKI (JP)
Application Number:
PCT/JP2023/003007
Publication Date:
August 03, 2023
Filing Date:
January 31, 2023
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
C08L101/00; H05K1/03
Domestic Patent References:
| WO2021166847A1 | 2021-08-26 | |||
| WO2019026927A1 | 2019-02-07 |
Foreign References:
| JP2016529205A | 2016-09-23 | |||
| JPS63145325A | 1988-06-17 | |||
| US20160289429A1 | 2016-10-06 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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